High-frequency flexible circuit board with high dielectric thickness
The utility model relates to the technical field of high-frequency flexible circuit boards, and discloses a high-frequency flexible circuit board with high dielectric thickness, which comprises an isolation box, a mainboard assembly is connected in the isolation box, the top of the isolation box is...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WANG LIKANG MA LINFENG LIU WENPENG MA NENGJUN MAO YONGQIANG |
| description | The utility model relates to the technical field of high-frequency flexible circuit boards, and discloses a high-frequency flexible circuit board with high dielectric thickness, which comprises an isolation box, a mainboard assembly is connected in the isolation box, the top of the isolation box is connected with a top cover, the top of the top cover and the bottom of the isolation box are connected with filter plates, and the filter plates are connected with the mainboard assembly. And connecting frames are connected to the two sides of the interior of the isolation box correspondingly, air bags are slidably connected to the interiors of the connecting frames, cleaning mechanisms are connected to the tops and the bottoms of the air bags correspondingly, and each cleaning mechanism comprises a transverse plate. According to the high-frequency flexible circuit board with the high dielectric thickness, the situation that the mainboard assembly works at a high frequency to generate a large amount of heat and the |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN220653835UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN220653835UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN220653835UU3</originalsourceid><addsrcrecordid>eNqNyrEOgjAUBdAuDkb9hxd3EkODcUcNk5PMpDxu7YtNwbZE_Xsd_ACns5ylOjZyc4WNeMwI_Cbr8ZLeg1giz5KpH00c6CnZkftWGgQenKMwZSd8D0hprRbW-ITNz5Xank_XuikwjR3SZBgBuasvZbnbV_qgq7bVf6UPPk4z6A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High-frequency flexible circuit board with high dielectric thickness</title><source>esp@cenet</source><creator>WANG LIKANG ; MA LINFENG ; LIU WENPENG ; MA NENGJUN ; MAO YONGQIANG</creator><creatorcontrib>WANG LIKANG ; MA LINFENG ; LIU WENPENG ; MA NENGJUN ; MAO YONGQIANG</creatorcontrib><description>The utility model relates to the technical field of high-frequency flexible circuit boards, and discloses a high-frequency flexible circuit board with high dielectric thickness, which comprises an isolation box, a mainboard assembly is connected in the isolation box, the top of the isolation box is connected with a top cover, the top of the top cover and the bottom of the isolation box are connected with filter plates, and the filter plates are connected with the mainboard assembly. And connecting frames are connected to the two sides of the interior of the isolation box correspondingly, air bags are slidably connected to the interiors of the connecting frames, cleaning mechanisms are connected to the tops and the bottoms of the air bags correspondingly, and each cleaning mechanism comprises a transverse plate. According to the high-frequency flexible circuit board with the high dielectric thickness, the situation that the mainboard assembly works at a high frequency to generate a large amount of heat and the</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240322&DB=EPODOC&CC=CN&NR=220653835U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240322&DB=EPODOC&CC=CN&NR=220653835U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG LIKANG</creatorcontrib><creatorcontrib>MA LINFENG</creatorcontrib><creatorcontrib>LIU WENPENG</creatorcontrib><creatorcontrib>MA NENGJUN</creatorcontrib><creatorcontrib>MAO YONGQIANG</creatorcontrib><title>High-frequency flexible circuit board with high dielectric thickness</title><description>The utility model relates to the technical field of high-frequency flexible circuit boards, and discloses a high-frequency flexible circuit board with high dielectric thickness, which comprises an isolation box, a mainboard assembly is connected in the isolation box, the top of the isolation box is connected with a top cover, the top of the top cover and the bottom of the isolation box are connected with filter plates, and the filter plates are connected with the mainboard assembly. And connecting frames are connected to the two sides of the interior of the isolation box correspondingly, air bags are slidably connected to the interiors of the connecting frames, cleaning mechanisms are connected to the tops and the bottoms of the air bags correspondingly, and each cleaning mechanism comprises a transverse plate. According to the high-frequency flexible circuit board with the high dielectric thickness, the situation that the mainboard assembly works at a high frequency to generate a large amount of heat and the</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEOgjAUBdAuDkb9hxd3EkODcUcNk5PMpDxu7YtNwbZE_Xsd_ACns5ylOjZyc4WNeMwI_Cbr8ZLeg1giz5KpH00c6CnZkftWGgQenKMwZSd8D0hprRbW-ITNz5Xank_XuikwjR3SZBgBuasvZbnbV_qgq7bVf6UPPk4z6A</recordid><startdate>20240322</startdate><enddate>20240322</enddate><creator>WANG LIKANG</creator><creator>MA LINFENG</creator><creator>LIU WENPENG</creator><creator>MA NENGJUN</creator><creator>MAO YONGQIANG</creator><scope>EVB</scope></search><sort><creationdate>20240322</creationdate><title>High-frequency flexible circuit board with high dielectric thickness</title><author>WANG LIKANG ; MA LINFENG ; LIU WENPENG ; MA NENGJUN ; MAO YONGQIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220653835UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG LIKANG</creatorcontrib><creatorcontrib>MA LINFENG</creatorcontrib><creatorcontrib>LIU WENPENG</creatorcontrib><creatorcontrib>MA NENGJUN</creatorcontrib><creatorcontrib>MAO YONGQIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG LIKANG</au><au>MA LINFENG</au><au>LIU WENPENG</au><au>MA NENGJUN</au><au>MAO YONGQIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-frequency flexible circuit board with high dielectric thickness</title><date>2024-03-22</date><risdate>2024</risdate><abstract>The utility model relates to the technical field of high-frequency flexible circuit boards, and discloses a high-frequency flexible circuit board with high dielectric thickness, which comprises an isolation box, a mainboard assembly is connected in the isolation box, the top of the isolation box is connected with a top cover, the top of the top cover and the bottom of the isolation box are connected with filter plates, and the filter plates are connected with the mainboard assembly. And connecting frames are connected to the two sides of the interior of the isolation box correspondingly, air bags are slidably connected to the interiors of the connecting frames, cleaning mechanisms are connected to the tops and the bottoms of the air bags correspondingly, and each cleaning mechanism comprises a transverse plate. According to the high-frequency flexible circuit board with the high dielectric thickness, the situation that the mainboard assembly works at a high frequency to generate a large amount of heat and the</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN220653835UU |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | High-frequency flexible circuit board with high dielectric thickness |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T05%3A32%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20LIKANG&rft.date=2024-03-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN220653835UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |