Printed circuit board structure capable of increasing friction force of screw holes

The utility model relates to a printed circuit board structure capable of increasing friction force of a screw hole, which comprises at least one target screw position, the target screw position comprises the screw hole and at least one windowing bonding pad arranged around the screw hole, the dista...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: RAN JIANFEI, WU ZHANLI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator RAN JIANFEI
WU ZHANLI
description The utility model relates to a printed circuit board structure capable of increasing friction force of a screw hole, which comprises at least one target screw position, the target screw position comprises the screw hole and at least one windowing bonding pad arranged around the screw hole, the distance between the windowing bonding pad and the target screw hole meets a first preset requirement, a solder paste layer is attached to the windowing bonding pad, and a solder paste layer is attached to the solder paste layer. The roughness of the surface of the solder paste layer meets a second preset requirement, the solder paste layer is an unsmooth coating formed on the windowing bonding pad after the surface of the windowing bonding pad is coated with solder paste and the printed circuit board is subjected to furnace passing, the printed circuit board further comprises target screws matched with the target screw positions, each target screw comprises a screw head and a screw rod, and the screw heads are matched
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN220570718UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN220570718UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN220570718UU3</originalsourceid><addsrcrecordid>eNqNyrEKwkAMgOEuDqK-Q3AXakXqXhQnEbRzuaY5DRyXI7nD11fEB3D6h--fV7ercsw0AbJi4QyjOJ3AshbMRQnQJTcGAvHAEZWccXyAV8bMEsGL4hftYy94SiBbVjPvgtHq10W1Ph3v3XlDSQay5JAi5aG7NE29b-t2e-j73V_TG_C_OXE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed circuit board structure capable of increasing friction force of screw holes</title><source>esp@cenet</source><creator>RAN JIANFEI ; WU ZHANLI</creator><creatorcontrib>RAN JIANFEI ; WU ZHANLI</creatorcontrib><description>The utility model relates to a printed circuit board structure capable of increasing friction force of a screw hole, which comprises at least one target screw position, the target screw position comprises the screw hole and at least one windowing bonding pad arranged around the screw hole, the distance between the windowing bonding pad and the target screw hole meets a first preset requirement, a solder paste layer is attached to the windowing bonding pad, and a solder paste layer is attached to the solder paste layer. The roughness of the surface of the solder paste layer meets a second preset requirement, the solder paste layer is an unsmooth coating formed on the windowing bonding pad after the surface of the windowing bonding pad is coated with solder paste and the printed circuit board is subjected to furnace passing, the printed circuit board further comprises target screws matched with the target screw positions, each target screw comprises a screw head and a screw rod, and the screw heads are matched</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240308&amp;DB=EPODOC&amp;CC=CN&amp;NR=220570718U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240308&amp;DB=EPODOC&amp;CC=CN&amp;NR=220570718U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAN JIANFEI</creatorcontrib><creatorcontrib>WU ZHANLI</creatorcontrib><title>Printed circuit board structure capable of increasing friction force of screw holes</title><description>The utility model relates to a printed circuit board structure capable of increasing friction force of a screw hole, which comprises at least one target screw position, the target screw position comprises the screw hole and at least one windowing bonding pad arranged around the screw hole, the distance between the windowing bonding pad and the target screw hole meets a first preset requirement, a solder paste layer is attached to the windowing bonding pad, and a solder paste layer is attached to the solder paste layer. The roughness of the surface of the solder paste layer meets a second preset requirement, the solder paste layer is an unsmooth coating formed on the windowing bonding pad after the surface of the windowing bonding pad is coated with solder paste and the printed circuit board is subjected to furnace passing, the printed circuit board further comprises target screws matched with the target screw positions, each target screw comprises a screw head and a screw rod, and the screw heads are matched</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwkAMgOEuDqK-Q3AXakXqXhQnEbRzuaY5DRyXI7nD11fEB3D6h--fV7ercsw0AbJi4QyjOJ3AshbMRQnQJTcGAvHAEZWccXyAV8bMEsGL4hftYy94SiBbVjPvgtHq10W1Ph3v3XlDSQay5JAi5aG7NE29b-t2e-j73V_TG_C_OXE</recordid><startdate>20240308</startdate><enddate>20240308</enddate><creator>RAN JIANFEI</creator><creator>WU ZHANLI</creator><scope>EVB</scope></search><sort><creationdate>20240308</creationdate><title>Printed circuit board structure capable of increasing friction force of screw holes</title><author>RAN JIANFEI ; WU ZHANLI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220570718UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>RAN JIANFEI</creatorcontrib><creatorcontrib>WU ZHANLI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAN JIANFEI</au><au>WU ZHANLI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board structure capable of increasing friction force of screw holes</title><date>2024-03-08</date><risdate>2024</risdate><abstract>The utility model relates to a printed circuit board structure capable of increasing friction force of a screw hole, which comprises at least one target screw position, the target screw position comprises the screw hole and at least one windowing bonding pad arranged around the screw hole, the distance between the windowing bonding pad and the target screw hole meets a first preset requirement, a solder paste layer is attached to the windowing bonding pad, and a solder paste layer is attached to the solder paste layer. The roughness of the surface of the solder paste layer meets a second preset requirement, the solder paste layer is an unsmooth coating formed on the windowing bonding pad after the surface of the windowing bonding pad is coated with solder paste and the printed circuit board is subjected to furnace passing, the printed circuit board further comprises target screws matched with the target screw positions, each target screw comprises a screw head and a screw rod, and the screw heads are matched</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN220570718UU
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed circuit board structure capable of increasing friction force of screw holes
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T13%3A10%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RAN%20JIANFEI&rft.date=2024-03-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN220570718UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true