Multi-chip ball mounting manual jig

Multi-chip ball mounting manual jig

The multi-chip ball mounting manual jig comprises a chip positioning seat, a sealing frame, a positioning plate and a blocking frame which are sequentially stacked layer by layer, a plurality of chip positioning grooves are formed in the upper end face of the chip positioning seat in an array mode,...

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Hauptverfasser: CAO ENLIN, GUO FANGLEI, DUAN GUOJIAN, GUO WEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CAO ENLIN
GUO FANGLEI
DUAN GUOJIAN
GUO WEI
description The multi-chip ball mounting manual jig comprises a chip positioning seat, a sealing frame, a positioning plate and a blocking frame which are sequentially stacked layer by layer, a plurality of chip positioning grooves are formed in the upper end face of the chip positioning seat in an array mode, chip adsorption tables are arranged in the chip positioning grooves, and air exhaust grooves are formed in the centers of the chip adsorption tables. An air exhaust groove is formed in the chip positioning seat, an air exhaust hole is formed in the air exhaust groove, waste material flow channels are arranged on the two sides of all the chip positioning grooves, all the waste material flow channels are converged in waste material grooves which are in annular connection on the peripheries of all the chip positioning grooves and used for receiving scaling powder or solder paste remaining materials falling off from the surfaces of the chips, and the remaining materials are discharged through a discharging opening form
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An air exhaust groove is formed in the chip positioning seat, an air exhaust hole is formed in the air exhaust groove, waste material flow channels are arranged on the two sides of all the chip positioning grooves, all the waste material flow channels are converged in waste material grooves which are in annular connection on the peripheries of all the chip positioning grooves and used for receiving scaling powder or solder paste remaining materials falling off from the surfaces of the chips, and the remaining materials are discharged through a discharging opening form</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240119&amp;DB=EPODOC&amp;CC=CN&amp;NR=220367900U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240119&amp;DB=EPODOC&amp;CC=CN&amp;NR=220367900U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAO ENLIN</creatorcontrib><creatorcontrib>GUO FANGLEI</creatorcontrib><creatorcontrib>DUAN GUOJIAN</creatorcontrib><creatorcontrib>GUO WEI</creatorcontrib><title>Multi-chip ball mounting manual jig</title><description>The multi-chip ball mounting manual jig comprises a chip positioning seat, a sealing frame, a positioning plate and a blocking frame which are sequentially stacked layer by layer, a plurality of chip positioning grooves are formed in the upper end face of the chip positioning seat in an array mode, chip adsorption tables are arranged in the chip positioning grooves, and air exhaust grooves are formed in the centers of the chip adsorption tables. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Multi-chip ball mounting manual jig
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