MEMS micro spring needle overall vertical signal conduction mechanism

The utility model discloses an MEMS micro spring needle integral vertical signal conduction mechanism, comprising a PCB circuit board, a conduction board and an MLC ceramic circuit, the conduction board is provided with a plurality of conduction holes, the conduction holes are vertically arranged, and the conduction holes are internally provided with MEMS micro spring probes; the PCB is connected with the MLC ceramic circuit through a mounting piece, and the conduction board is arranged in a gap between the PCB and the MLC ceramic circuit; the two ends of the MEMS micro-spring probe are in contact with the PCB and the MLC ceramic circuit respectively. By adopting the MEMS micro-spring probe, the MEMS micro-spring probe can deform in a pressed process, so that the whole operation process is simple and convenient, the contact performance is high, the cost is relatively low, and the conduction test of a semiconductor large-scale integrated circuit is easy. And after the two sides of the MEMS micro-spring probe a