Electronic component
The utility model provides an electronic component, and one embodiment of the electronic component comprises a first chip, the first chip is provided with a first surface and a second surface opposite to the first surface, and the first chip is further provided with a power path passing through the...
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| creator | MIN FANYU XIE MENGWEI |
| description | The utility model provides an electronic component, and one embodiment of the electronic component comprises a first chip, the first chip is provided with a first surface and a second surface opposite to the first surface, and the first chip is further provided with a power path passing through the first surface and a signal path passing through the second surface; the voltage management element is arranged adjacent to the first chip, the voltage management element is provided with a conductive component, the surface of the conductive component is substantially flush with the first surface, and the conductive component provides power for the first chip through the first surface. The voltage management element and the chip are adjacently arranged, the surface of the voltage management element does not exceed the surface of the chip, and the voltage management element and the chip are located at the same horizontal height, so that the thickness of the whole electronic element can be reduced, and miniaturization |
| format | Patent |
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The voltage management element and the chip are adjacently arranged, the surface of the voltage management element does not exceed the surface of the chip, and the voltage management element and the chip are located at the same horizontal height, so that the thickness of the whole electronic element can be reduced, and miniaturization</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231219&DB=EPODOC&CC=CN&NR=220208970U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231219&DB=EPODOC&CC=CN&NR=220208970U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIN FANYU</creatorcontrib><creatorcontrib>XIE MENGWEI</creatorcontrib><title>Electronic component</title><description>The utility model provides an electronic component, and one embodiment of the electronic component comprises a first chip, the first chip is provided with a first surface and a second surface opposite to the first surface, and the first chip is further provided with a power path passing through the first surface and a signal path passing through the second surface; the voltage management element is arranged adjacent to the first chip, the voltage management element is provided with a conductive component, the surface of the conductive component is substantially flush with the first surface, and the conductive component provides power for the first chip through the first surface. The voltage management element and the chip are adjacently arranged, the surface of the voltage management element does not exceed the surface of the chip, and the voltage management element and the chip are located at the same horizontal height, so that the thickness of the whole electronic element can be reduced, and miniaturization</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxzUlNLinKz8tMVkjOzy3Iz0vNK-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkZGBkYGFpbmBqGhxkQpAgCoeSHG</recordid><startdate>20231219</startdate><enddate>20231219</enddate><creator>MIN FANYU</creator><creator>XIE MENGWEI</creator><scope>EVB</scope></search><sort><creationdate>20231219</creationdate><title>Electronic component</title><author>MIN FANYU ; XIE MENGWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN220208970UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MIN FANYU</creatorcontrib><creatorcontrib>XIE MENGWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIN FANYU</au><au>XIE MENGWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component</title><date>2023-12-19</date><risdate>2023</risdate><abstract>The utility model provides an electronic component, and one embodiment of the electronic component comprises a first chip, the first chip is provided with a first surface and a second surface opposite to the first surface, and the first chip is further provided with a power path passing through the first surface and a signal path passing through the second surface; the voltage management element is arranged adjacent to the first chip, the voltage management element is provided with a conductive component, the surface of the conductive component is substantially flush with the first surface, and the conductive component provides power for the first chip through the first surface. The voltage management element and the chip are adjacently arranged, the surface of the voltage management element does not exceed the surface of the chip, and the voltage management element and the chip are located at the same horizontal height, so that the thickness of the whole electronic element can be reduced, and miniaturization</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN220208970UU |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Electronic component |
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