Wafer cutting and clamping tool

Wafer cutting and clamping tool

The wafer cutting and clamping tool comprises a machining table, a protective cover, a side plate, a top plate, a cutting device, a limiting mechanism and an adjusting mechanism, the protective cover is arranged on the right side of the top face of the machining table, the adjusting mechanism is arr...

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Hauptverfasser: SEOL SHIN SHIN, SHI NINGDI, HOU CHENGMING, CAO HAIYANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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creator SEOL SHIN SHIN
SHI NINGDI
HOU CHENGMING
CAO HAIYANG
description The wafer cutting and clamping tool comprises a machining table, a protective cover, a side plate, a top plate, a cutting device, a limiting mechanism and an adjusting mechanism, the protective cover is arranged on the right side of the top face of the machining table, the adjusting mechanism is arranged in the protective cover, the side plate is arranged on the left side of the machining table, and the top plate is arranged on the side plate. The wafer cutting and clamping tool solves the problem that an existing device cannot effectively adapt to wafers of different sizes due to the fact that the inner diameters of placing plates are consistent all the time when the placing plates are combined. 本实用新型公开了一种晶圆切割装夹工装，包括：加工台、防护罩、侧板、顶板、切割装置、限位机构、调节机构，加工台的顶面右侧设有防护罩，所述防护罩的内部设有调节机构，所述加工台的左侧设有侧板，所述侧板的顶部朝向防护罩的一侧延伸有顶板，所述顶板的内底面设有切割装置，本实用新型提供了一种晶圆切割装夹工装解决现有装置由于放置板的内径在合并时始终是一致的直径，并未能够有效解决适用不同尺寸的晶圆片的问题。
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The wafer cutting and clamping tool solves the problem that an existing device cannot effectively adapt to wafers of different sizes due to the fact that the inner diameters of placing plates are consistent all the time when the placing plates are combined. 本实用新型公开了一种晶圆切割装夹工装，包括：加工台、防护罩、侧板、顶板、切割装置、限位机构、调节机构，加工台的顶面右侧设有防护罩，所述防护罩的内部设有调节机构，所述加工台的左侧设有侧板，所述侧板的顶部朝向防护罩的一侧延伸有顶板，所述顶板的内底面设有切割装置，本实用新型提供了一种晶圆切割装夹工装解决现有装置由于放置板的内径在合并时始终是一致的直径，并未能够有效解决适用不同尺寸的晶圆片的问题。</description><language>chi ; eng</language><subject>PERFORMING OPERATIONS ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231124&amp;DB=EPODOC&amp;CC=CN&amp;NR=220075164U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231124&amp;DB=EPODOC&amp;CC=CN&amp;NR=220075164U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEOL SHIN SHIN</creatorcontrib><creatorcontrib>SHI NINGDI</creatorcontrib><creatorcontrib>HOU CHENGMING</creatorcontrib><creatorcontrib>CAO HAIYANG</creatorcontrib><title>Wafer cutting and clamping tool</title><description>The wafer cutting and clamping tool comprises a machining table, a protective cover, a side plate, a top plate, a cutting device, a limiting mechanism and an adjusting mechanism, the protective cover is arranged on the right side of the top face of the machining table, the adjusting mechanism is arranged in the protective cover, the side plate is arranged on the left side of the machining table, and the top plate is arranged on the side plate. 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language chi ; eng
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subjects PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
title Wafer cutting and clamping tool
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