Water-cooled heat dissipation device with expansion mechanism

Water-cooled heat dissipation device with expansion mechanism

The utility model provides a water cooling type heat dissipation device with an expansion mechanism, which comprises a water cooling head, a fan module and an expansion module, the water cooling head comprises a main body, a water inlet joint communicated with the main body and a water outlet joint...

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Hauptverfasser: QI YANSHU, LIU GUANYOU
Format: Patent
Sprache:chi ; eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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creator QI YANSHU
LIU GUANYOU
description The utility model provides a water cooling type heat dissipation device with an expansion mechanism, which comprises a water cooling head, a fan module and an expansion module, the water cooling head comprises a main body, a water inlet joint communicated with the main body and a water outlet joint communicated with the main body, and the main body is provided with a first connector; the fan module is arranged on the water cooling head and comprises a base and a fan, the base is connected with the main body and is provided with a second connector electrically connected with the first connector and the fan, and the fan is connected with the base and is provided with an impeller formed in the external space of the main body; the expansion module is arranged on the fan module. Therefore, not only can the heat dissipation requirement of the electronic heating elements on the periphery of the central processing unit be met, but also the expansion function can be provided according to various different use requirem
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219936376UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219936376UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219936376UU3</originalsourceid><addsrcrecordid>eNrjZLANTyxJLdJNzs_PSU1RyEhNLFFIySwuzixILMnMz1NISS3LTE5VKM8syVBIrShIzCsGieamJmck5mUW5_IwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknhnPyNDS0tjM2Nzs9BQY6IUAQCvnTF5</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Water-cooled heat dissipation device with expansion mechanism</title><source>esp@cenet</source><creator>QI YANSHU ; LIU GUANYOU</creator><creatorcontrib>QI YANSHU ; LIU GUANYOU</creatorcontrib><description>The utility model provides a water cooling type heat dissipation device with an expansion mechanism, which comprises a water cooling head, a fan module and an expansion module, the water cooling head comprises a main body, a water inlet joint communicated with the main body and a water outlet joint communicated with the main body, and the main body is provided with a first connector; the fan module is arranged on the water cooling head and comprises a base and a fan, the base is connected with the main body and is provided with a second connector electrically connected with the first connector and the fan, and the fan is connected with the base and is provided with an impeller formed in the external space of the main body; the expansion module is arranged on the fan module. Therefore, not only can the heat dissipation requirement of the electronic heating elements on the periphery of the central processing unit be met, but also the expansion function can be provided according to various different use requirem</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231031&amp;DB=EPODOC&amp;CC=CN&amp;NR=219936376U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231031&amp;DB=EPODOC&amp;CC=CN&amp;NR=219936376U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QI YANSHU</creatorcontrib><creatorcontrib>LIU GUANYOU</creatorcontrib><title>Water-cooled heat dissipation device with expansion mechanism</title><description>The utility model provides a water cooling type heat dissipation device with an expansion mechanism, which comprises a water cooling head, a fan module and an expansion module, the water cooling head comprises a main body, a water inlet joint communicated with the main body and a water outlet joint communicated with the main body, and the main body is provided with a first connector; the fan module is arranged on the water cooling head and comprises a base and a fan, the base is connected with the main body and is provided with a second connector electrically connected with the first connector and the fan, and the fan is connected with the base and is provided with an impeller formed in the external space of the main body; the expansion module is arranged on the fan module. Therefore, not only can the heat dissipation requirement of the electronic heating elements on the periphery of the central processing unit be met, but also the expansion function can be provided according to various different use requirem</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLANTyxJLdJNzs_PSU1RyEhNLFFIySwuzixILMnMz1NISS3LTE5VKM8syVBIrShIzCsGieamJmck5mUW5_IwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknhnPyNDS0tjM2Nzs9BQY6IUAQCvnTF5</recordid><startdate>20231031</startdate><enddate>20231031</enddate><creator>QI YANSHU</creator><creator>LIU GUANYOU</creator><scope>EVB</scope></search><sort><creationdate>20231031</creationdate><title>Water-cooled heat dissipation device with expansion mechanism</title><author>QI YANSHU ; LIU GUANYOU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219936376UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>QI YANSHU</creatorcontrib><creatorcontrib>LIU GUANYOU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QI YANSHU</au><au>LIU GUANYOU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Water-cooled heat dissipation device with expansion mechanism</title><date>2023-10-31</date><risdate>2023</risdate><abstract>The utility model provides a water cooling type heat dissipation device with an expansion mechanism, which comprises a water cooling head, a fan module and an expansion module, the water cooling head comprises a main body, a water inlet joint communicated with the main body and a water outlet joint communicated with the main body, and the main body is provided with a first connector; the fan module is arranged on the water cooling head and comprises a base and a fan, the base is connected with the main body and is provided with a second connector electrically connected with the first connector and the fan, and the fan is connected with the base and is provided with an impeller formed in the external space of the main body; the expansion module is arranged on the fan module. Therefore, not only can the heat dissipation requirement of the electronic heating elements on the periphery of the central processing unit be met, but also the expansion function can be provided according to various different use requirem</abstract><oa>free_for_read</oa></addata></record>
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subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title Water-cooled heat dissipation device with expansion mechanism
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T13%3A21%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=QI%20YANSHU&rft.date=2023-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN219936376UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true