Silicon wafer grinding protection device
The utility model discloses a silicon wafer grinding protection device. The silicon wafer grinding protection device comprises a cross beam installed on a grinding machine table, a lifting column is installed on the cross beam, the lifting column is driven by a hydraulic cylinder installed on the cr...
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| creator | SEOL SHIN SHIN SHI NINGDI HOU CHENGMING CAO HAIYANG |
| description | The utility model discloses a silicon wafer grinding protection device. The silicon wafer grinding protection device comprises a cross beam installed on a grinding machine table, a lifting column is installed on the cross beam, the lifting column is driven by a hydraulic cylinder installed on the cross beam, a protection cover is installed on the lifting column, and the protection cover is matched with the grinding machine table. According to the silicon wafer grinding protective device, the protective cover matched with the grinding machine table is installed on the lifting column of the grinding disc, the upper portion of the grinding machine table can be completely surrounded and covered, dust, broken crystal chips and other foreign matter are prevented from entering the grinding machine table, waste water is prevented from splashing all around and polluting surrounding to-be-ground wafers, clamps and other materials, and the service life of the silicon wafer grinding protective device is prolonged. And me |
| format | Patent |
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The silicon wafer grinding protection device comprises a cross beam installed on a grinding machine table, a lifting column is installed on the cross beam, the lifting column is driven by a hydraulic cylinder installed on the cross beam, a protection cover is installed on the lifting column, and the protection cover is matched with the grinding machine table. According to the silicon wafer grinding protective device, the protective cover matched with the grinding machine table is installed on the lifting column of the grinding disc, the upper portion of the grinding machine table can be completely surrounded and covered, dust, broken crystal chips and other foreign matter are prevented from entering the grinding machine table, waste water is prevented from splashing all around and polluting surrounding to-be-ground wafers, clamps and other materials, and the service life of the silicon wafer grinding protective device is prolonged. And me</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231010&DB=EPODOC&CC=CN&NR=219805900U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231010&DB=EPODOC&CC=CN&NR=219805900U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEOL SHIN SHIN</creatorcontrib><creatorcontrib>SHI NINGDI</creatorcontrib><creatorcontrib>HOU CHENGMING</creatorcontrib><creatorcontrib>CAO HAIYANG</creatorcontrib><title>Silicon wafer grinding protection device</title><description>The utility model discloses a silicon wafer grinding protection device. The silicon wafer grinding protection device comprises a cross beam installed on a grinding machine table, a lifting column is installed on the cross beam, the lifting column is driven by a hydraulic cylinder installed on the cross beam, a protection cover is installed on the lifting column, and the protection cover is matched with the grinding machine table. According to the silicon wafer grinding protective device, the protective cover matched with the grinding machine table is installed on the lifting column of the grinding disc, the upper portion of the grinding machine table can be completely surrounded and covered, dust, broken crystal chips and other foreign matter are prevented from entering the grinding machine table, waste water is prevented from splashing all around and polluting surrounding to-be-ground wafers, clamps and other materials, and the service life of the silicon wafer grinding protective device is prolonged. And me</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAIzszJTM7PUyhPTEstUkgvysxLycxLVygoyi9JTS7JBMqkpJZlJqfyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz8jQ0sLA1NLA4PQUGOiFAEAPSIpVg</recordid><startdate>20231010</startdate><enddate>20231010</enddate><creator>SEOL SHIN SHIN</creator><creator>SHI NINGDI</creator><creator>HOU CHENGMING</creator><creator>CAO HAIYANG</creator><scope>EVB</scope></search><sort><creationdate>20231010</creationdate><title>Silicon wafer grinding protection device</title><author>SEOL SHIN SHIN ; SHI NINGDI ; HOU CHENGMING ; CAO HAIYANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219805900UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SEOL SHIN SHIN</creatorcontrib><creatorcontrib>SHI NINGDI</creatorcontrib><creatorcontrib>HOU CHENGMING</creatorcontrib><creatorcontrib>CAO HAIYANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEOL SHIN SHIN</au><au>SHI NINGDI</au><au>HOU CHENGMING</au><au>CAO HAIYANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Silicon wafer grinding protection device</title><date>2023-10-10</date><risdate>2023</risdate><abstract>The utility model discloses a silicon wafer grinding protection device. The silicon wafer grinding protection device comprises a cross beam installed on a grinding machine table, a lifting column is installed on the cross beam, the lifting column is driven by a hydraulic cylinder installed on the cross beam, a protection cover is installed on the lifting column, and the protection cover is matched with the grinding machine table. According to the silicon wafer grinding protective device, the protective cover matched with the grinding machine table is installed on the lifting column of the grinding disc, the upper portion of the grinding machine table can be completely surrounded and covered, dust, broken crystal chips and other foreign matter are prevented from entering the grinding machine table, waste water is prevented from splashing all around and polluting surrounding to-be-ground wafers, clamps and other materials, and the service life of the silicon wafer grinding protective device is prolonged. And me</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN219805900UU |
| source | esp@cenet |
| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Silicon wafer grinding protection device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T23%3A29%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SEOL%20SHIN%20SHIN&rft.date=2023-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN219805900UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |