SOT bonding wire pressing plate
The SOT bonding wire pressing plate comprises an upper clamp and a lower clamp, the center of the bottom of the lower clamp is provided with a vacuum adsorption port communicated with vacuum adsorption equipment, the center of the surface of the lower clamp is uniformly provided with a plurality of...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TANG JIAYUN ZHU SHUANGXIN |
| description | The SOT bonding wire pressing plate comprises an upper clamp and a lower clamp, the center of the bottom of the lower clamp is provided with a vacuum adsorption port communicated with vacuum adsorption equipment, the center of the surface of the lower clamp is uniformly provided with a plurality of vacuum adsorption holes corresponding to bonding wire positions of an SOT packaging frame, and the vacuum adsorption holes are communicated with the vacuum adsorption port through vacuum adsorption channels. A plurality of positioning holes are uniformly formed in the center of the surface of the upper clamp corresponding to the bonding wire position of the packaging frame, the plurality of positioning holes are formed in a positioning groove in the center of the surface of the upper clamp in multiple groups, pressing convex strips are arranged at the bottom of the upper clamp corresponding to the gap position of the SOT packaging frame, and a plurality of heat dissipation holes are formed in two sides of the surfa |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219787173UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219787173UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219787173UU3</originalsourceid><addsrcrecordid>eNrjZJAP9g9RSMrPS8nMS1cozyxKVSgoSi0uBvEKchJLUnkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhpbmFuaG5cWioMVGKAFVfJYM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOT bonding wire pressing plate</title><source>esp@cenet</source><creator>TANG JIAYUN ; ZHU SHUANGXIN</creator><creatorcontrib>TANG JIAYUN ; ZHU SHUANGXIN</creatorcontrib><description>The SOT bonding wire pressing plate comprises an upper clamp and a lower clamp, the center of the bottom of the lower clamp is provided with a vacuum adsorption port communicated with vacuum adsorption equipment, the center of the surface of the lower clamp is uniformly provided with a plurality of vacuum adsorption holes corresponding to bonding wire positions of an SOT packaging frame, and the vacuum adsorption holes are communicated with the vacuum adsorption port through vacuum adsorption channels. A plurality of positioning holes are uniformly formed in the center of the surface of the upper clamp corresponding to the bonding wire position of the packaging frame, the plurality of positioning holes are formed in a positioning groove in the center of the surface of the upper clamp in multiple groups, pressing convex strips are arranged at the bottom of the upper clamp corresponding to the gap position of the SOT packaging frame, and a plurality of heat dissipation holes are formed in two sides of the surfa</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231003&DB=EPODOC&CC=CN&NR=219787173U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231003&DB=EPODOC&CC=CN&NR=219787173U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANG JIAYUN</creatorcontrib><creatorcontrib>ZHU SHUANGXIN</creatorcontrib><title>SOT bonding wire pressing plate</title><description>The SOT bonding wire pressing plate comprises an upper clamp and a lower clamp, the center of the bottom of the lower clamp is provided with a vacuum adsorption port communicated with vacuum adsorption equipment, the center of the surface of the lower clamp is uniformly provided with a plurality of vacuum adsorption holes corresponding to bonding wire positions of an SOT packaging frame, and the vacuum adsorption holes are communicated with the vacuum adsorption port through vacuum adsorption channels. A plurality of positioning holes are uniformly formed in the center of the surface of the upper clamp corresponding to the bonding wire position of the packaging frame, the plurality of positioning holes are formed in a positioning groove in the center of the surface of the upper clamp in multiple groups, pressing convex strips are arranged at the bottom of the upper clamp corresponding to the gap position of the SOT packaging frame, and a plurality of heat dissipation holes are formed in two sides of the surfa</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAP9g9RSMrPS8nMS1cozyxKVSgoSi0uBvEKchJLUnkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhpbmFuaG5cWioMVGKAFVfJYM</recordid><startdate>20231003</startdate><enddate>20231003</enddate><creator>TANG JIAYUN</creator><creator>ZHU SHUANGXIN</creator><scope>EVB</scope></search><sort><creationdate>20231003</creationdate><title>SOT bonding wire pressing plate</title><author>TANG JIAYUN ; ZHU SHUANGXIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219787173UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>TANG JIAYUN</creatorcontrib><creatorcontrib>ZHU SHUANGXIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANG JIAYUN</au><au>ZHU SHUANGXIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOT bonding wire pressing plate</title><date>2023-10-03</date><risdate>2023</risdate><abstract>The SOT bonding wire pressing plate comprises an upper clamp and a lower clamp, the center of the bottom of the lower clamp is provided with a vacuum adsorption port communicated with vacuum adsorption equipment, the center of the surface of the lower clamp is uniformly provided with a plurality of vacuum adsorption holes corresponding to bonding wire positions of an SOT packaging frame, and the vacuum adsorption holes are communicated with the vacuum adsorption port through vacuum adsorption channels. A plurality of positioning holes are uniformly formed in the center of the surface of the upper clamp corresponding to the bonding wire position of the packaging frame, the plurality of positioning holes are formed in a positioning groove in the center of the surface of the upper clamp in multiple groups, pressing convex strips are arranged at the bottom of the upper clamp corresponding to the gap position of the SOT packaging frame, and a plurality of heat dissipation holes are formed in two sides of the surfa</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN219787173UU |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SOT bonding wire pressing plate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T08%3A50%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TANG%20JIAYUN&rft.date=2023-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN219787173UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |