Vacuum adsorption type taking and placing device

The utility model relates to the technical field of bearing devices, and discloses a vacuum adsorption type taking and placing device which comprises a taking and placing piece and at least three adsorption rings. The pick-and-place piece is provided with an adsorption surface, the adsorption rings are arranged on the adsorption surface, the at least three adsorption rings are arranged on the adsorption surface in a triangular shape, the adsorption rings are made of elastic materials, and a vacuum flow channel is formed in the pick-and-place piece and communicated with inner cavities of the adsorption rings. In the vacuum adsorption type pick-and-place device provided by the utility model, the stress of each adsorption ring is more uniform, so that the pick-and-place of the adsorption rings is more stable, and when the wafer has a certain warping degree, compared with long-strip-shaped single-point adsorption, three-point adsorption is in full fit contact with the surface of the wafer, so that the wafer is pr