Cutting device and wire cutting equipment

The embodiment of the utility model provides a cutting device and linear cutting equipment, and the cutting device comprises a cutting frame; the two cutting machine heads are arranged on the cutting frame; the two cutting machine heads can move in the vertical direction relative to the cutting frame so that a to-be-cut piece can be cut through a cutting line wound around at least one cutting machine head. The at least one cutting machine head can move in the transverse direction relative to the cutting frame. A cutting machine head can move to the center position of the top of the to-be-cut piece so as to vertically move at the position to cut the to-be-cut piece. According to the cutting device and the linear cutting equipment, the requirement for cutting the square rod into the half rods with the small cross sectional area can be met, and small silicon wafers with the small size are directly obtained by slicing the half rods subsequently. 本申请实施例提供一种切割装置及线切割设备，其中，切割装置包括：切割框架；两个切割机头，设置于切割框架上；两个切割机头可相对于切割框架沿竖