Circuit board for Bluetooth earphone charging bin
The utility model discloses a circuit board for a Bluetooth earphone charging cabin, and relates to the technical field of Bluetooth earphone charging cabins. The circuit board for the Bluetooth headset charging bin comprises an upper substrate, a lower substrate is arranged below the upper substrat...
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| creator | FENG TAO WANG DUNMENG DAI YINGYAN FENG JIANMING CAI MINGXIANG LI HOUQING |
| description | The utility model discloses a circuit board for a Bluetooth earphone charging cabin, and relates to the technical field of Bluetooth earphone charging cabins. The circuit board for the Bluetooth headset charging bin comprises an upper substrate, a lower substrate is arranged below the upper substrate, the upper surface of the upper substrate and the upper surface of the lower substrate are both of a plane structure, an upper circuit is arranged on the upper substrate, a lower circuit is arranged on the lower substrate, and heat dissipation assemblies are arranged on the surfaces of the upper substrate and the lower substrate. The printing device is simple and convenient to operate and convenient to use, the upper U-shaped protruding block, the upper U-shaped groove, the lower base plate, the lower U-shaped protruding block, the lower U-shaped groove, the first conduction mechanism and the second conduction mechanism are used in cooperation, the rejection rate is reduced, the printing difficulty is reduced, th |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219660187UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219660187UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219660187UU3</originalsourceid><addsrcrecordid>eNrjZDB0zixKLs0sUUjKTyxKUUjLL1JwyilNLcnPL8lQSE0sKsjIz0tVSM5ILErPzEtXSMrM42FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoaWZmYGhhbmoaHGRCkCAN_QLGI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board for Bluetooth earphone charging bin</title><source>esp@cenet</source><creator>FENG TAO ; WANG DUNMENG ; DAI YINGYAN ; FENG JIANMING ; CAI MINGXIANG ; LI HOUQING</creator><creatorcontrib>FENG TAO ; WANG DUNMENG ; DAI YINGYAN ; FENG JIANMING ; CAI MINGXIANG ; LI HOUQING</creatorcontrib><description>The utility model discloses a circuit board for a Bluetooth earphone charging cabin, and relates to the technical field of Bluetooth earphone charging cabins. The circuit board for the Bluetooth headset charging bin comprises an upper substrate, a lower substrate is arranged below the upper substrate, the upper surface of the upper substrate and the upper surface of the lower substrate are both of a plane structure, an upper circuit is arranged on the upper substrate, a lower circuit is arranged on the lower substrate, and heat dissipation assemblies are arranged on the surfaces of the upper substrate and the lower substrate. The printing device is simple and convenient to operate and convenient to use, the upper U-shaped protruding block, the upper U-shaped groove, the lower base plate, the lower U-shaped protruding block, the lower U-shaped groove, the first conduction mechanism and the second conduction mechanism are used in cooperation, the rejection rate is reduced, the printing difficulty is reduced, th</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230908&DB=EPODOC&CC=CN&NR=219660187U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230908&DB=EPODOC&CC=CN&NR=219660187U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FENG TAO</creatorcontrib><creatorcontrib>WANG DUNMENG</creatorcontrib><creatorcontrib>DAI YINGYAN</creatorcontrib><creatorcontrib>FENG JIANMING</creatorcontrib><creatorcontrib>CAI MINGXIANG</creatorcontrib><creatorcontrib>LI HOUQING</creatorcontrib><title>Circuit board for Bluetooth earphone charging bin</title><description>The utility model discloses a circuit board for a Bluetooth earphone charging cabin, and relates to the technical field of Bluetooth earphone charging cabins. The circuit board for the Bluetooth headset charging bin comprises an upper substrate, a lower substrate is arranged below the upper substrate, the upper surface of the upper substrate and the upper surface of the lower substrate are both of a plane structure, an upper circuit is arranged on the upper substrate, a lower circuit is arranged on the lower substrate, and heat dissipation assemblies are arranged on the surfaces of the upper substrate and the lower substrate. The printing device is simple and convenient to operate and convenient to use, the upper U-shaped protruding block, the upper U-shaped groove, the lower base plate, the lower U-shaped protruding block, the lower U-shaped groove, the first conduction mechanism and the second conduction mechanism are used in cooperation, the rejection rate is reduced, the printing difficulty is reduced, th</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB0zixKLs0sUUjKTyxKUUjLL1JwyilNLcnPL8lQSE0sKsjIz0tVSM5ILErPzEtXSMrM42FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoaWZmYGhhbmoaHGRCkCAN_QLGI</recordid><startdate>20230908</startdate><enddate>20230908</enddate><creator>FENG TAO</creator><creator>WANG DUNMENG</creator><creator>DAI YINGYAN</creator><creator>FENG JIANMING</creator><creator>CAI MINGXIANG</creator><creator>LI HOUQING</creator><scope>EVB</scope></search><sort><creationdate>20230908</creationdate><title>Circuit board for Bluetooth earphone charging bin</title><author>FENG TAO ; WANG DUNMENG ; DAI YINGYAN ; FENG JIANMING ; CAI MINGXIANG ; LI HOUQING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219660187UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FENG TAO</creatorcontrib><creatorcontrib>WANG DUNMENG</creatorcontrib><creatorcontrib>DAI YINGYAN</creatorcontrib><creatorcontrib>FENG JIANMING</creatorcontrib><creatorcontrib>CAI MINGXIANG</creatorcontrib><creatorcontrib>LI HOUQING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FENG TAO</au><au>WANG DUNMENG</au><au>DAI YINGYAN</au><au>FENG JIANMING</au><au>CAI MINGXIANG</au><au>LI HOUQING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board for Bluetooth earphone charging bin</title><date>2023-09-08</date><risdate>2023</risdate><abstract>The utility model discloses a circuit board for a Bluetooth earphone charging cabin, and relates to the technical field of Bluetooth earphone charging cabins. The circuit board for the Bluetooth headset charging bin comprises an upper substrate, a lower substrate is arranged below the upper substrate, the upper surface of the upper substrate and the upper surface of the lower substrate are both of a plane structure, an upper circuit is arranged on the upper substrate, a lower circuit is arranged on the lower substrate, and heat dissipation assemblies are arranged on the surfaces of the upper substrate and the lower substrate. The printing device is simple and convenient to operate and convenient to use, the upper U-shaped protruding block, the upper U-shaped groove, the lower base plate, the lower U-shaped protruding block, the lower U-shaped groove, the first conduction mechanism and the second conduction mechanism are used in cooperation, the rejection rate is reduced, the printing difficulty is reduced, th</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Circuit board for Bluetooth earphone charging bin |
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