Power supply heat dissipation mechanism for solid state storage device

The utility model relates to the technical field of power supply heat dissipation, in particular to a power supply heat dissipation mechanism for a solid state storage device, which comprises a box body, a heat dissipation groove is arranged at the top of the box body, a stop block is arranged at th...

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1. Verfasser: LEE KUN-WOO
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description The utility model relates to the technical field of power supply heat dissipation, in particular to a power supply heat dissipation mechanism for a solid state storage device, which comprises a box body, a heat dissipation groove is arranged at the top of the box body, a stop block is arranged at the top end of the box body, a hinge is connected to one side of the box body, and one end, far away from the box body, of the hinge is connected with a box door. A handle is installed on the surface of the side, away from the box body, of the box door, and a wiring port is formed in the surface of the side, away from the box door, of the box body. According to the utility model, through the arrangement of the heat dissipation fan, the annular heat dissipation pipeline and the heat dissipation holes, heat generated during working is discharged to the outer side of the box body, the heat is prevented from being gathered in the box body to influence use, and the annular heat dissipation pipeline ensures the heat dissip
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219626324UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219626324UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219626324UU3</originalsourceid><addsrcrecordid>eNrjZHALyC9PLVIoLi0oyKlUyEhNLFFIySwuzixILMnMz1PITU3OSMzLLM5VSMsHqsrPyUxRKC5JLEkFkvlFiempCimpZZnJqTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz8jQ0szIzNjIJDTUmChFANAzNMc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power supply heat dissipation mechanism for solid state storage device</title><source>esp@cenet</source><creator>LEE KUN-WOO</creator><creatorcontrib>LEE KUN-WOO</creatorcontrib><description>The utility model relates to the technical field of power supply heat dissipation, in particular to a power supply heat dissipation mechanism for a solid state storage device, which comprises a box body, a heat dissipation groove is arranged at the top of the box body, a stop block is arranged at the top end of the box body, a hinge is connected to one side of the box body, and one end, far away from the box body, of the hinge is connected with a box door. A handle is installed on the surface of the side, away from the box body, of the box door, and a wiring port is formed in the surface of the side, away from the box door, of the box body. According to the utility model, through the arrangement of the heat dissipation fan, the annular heat dissipation pipeline and the heat dissipation holes, heat generated during working is discharged to the outer side of the box body, the heat is prevented from being gathered in the box body to influence use, and the annular heat dissipation pipeline ensures the heat dissip</description><language>chi ; eng</language><subject>INFORMATION STORAGE ; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230901&amp;DB=EPODOC&amp;CC=CN&amp;NR=219626324U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230901&amp;DB=EPODOC&amp;CC=CN&amp;NR=219626324U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE KUN-WOO</creatorcontrib><title>Power supply heat dissipation mechanism for solid state storage device</title><description>The utility model relates to the technical field of power supply heat dissipation, in particular to a power supply heat dissipation mechanism for a solid state storage device, which comprises a box body, a heat dissipation groove is arranged at the top of the box body, a stop block is arranged at the top end of the box body, a hinge is connected to one side of the box body, and one end, far away from the box body, of the hinge is connected with a box door. A handle is installed on the surface of the side, away from the box body, of the box door, and a wiring port is formed in the surface of the side, away from the box door, of the box body. According to the utility model, through the arrangement of the heat dissipation fan, the annular heat dissipation pipeline and the heat dissipation holes, heat generated during working is discharged to the outer side of the box body, the heat is prevented from being gathered in the box body to influence use, and the annular heat dissipation pipeline ensures the heat dissip</description><subject>INFORMATION STORAGE</subject><subject>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALyC9PLVIoLi0oyKlUyEhNLFFIySwuzixILMnMz1PITU3OSMzLLM5VSMsHqsrPyUxRKC5JLEkFkvlFiempCimpZZnJqTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz8jQ0szIzNjIJDTUmChFANAzNMc</recordid><startdate>20230901</startdate><enddate>20230901</enddate><creator>LEE KUN-WOO</creator><scope>EVB</scope></search><sort><creationdate>20230901</creationdate><title>Power supply heat dissipation mechanism for solid state storage device</title><author>LEE KUN-WOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219626324UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>INFORMATION STORAGE</topic><topic>INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE KUN-WOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE KUN-WOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power supply heat dissipation mechanism for solid state storage device</title><date>2023-09-01</date><risdate>2023</risdate><abstract>The utility model relates to the technical field of power supply heat dissipation, in particular to a power supply heat dissipation mechanism for a solid state storage device, which comprises a box body, a heat dissipation groove is arranged at the top of the box body, a stop block is arranged at the top end of the box body, a hinge is connected to one side of the box body, and one end, far away from the box body, of the hinge is connected with a box door. A handle is installed on the surface of the side, away from the box body, of the box door, and a wiring port is formed in the surface of the side, away from the box door, of the box body. According to the utility model, through the arrangement of the heat dissipation fan, the annular heat dissipation pipeline and the heat dissipation holes, heat generated during working is discharged to the outer side of the box body, the heat is prevented from being gathered in the box body to influence use, and the annular heat dissipation pipeline ensures the heat dissip</abstract><oa>free_for_read</oa></addata></record>
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subjects INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
PHYSICS
title Power supply heat dissipation mechanism for solid state storage device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T08%3A59%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE%20KUN-WOO&rft.date=2023-09-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN219626324UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true