Miniature light-emitting structure and miniature light-emitting device
The embodiment of the utility model discloses a miniature light-emitting structure and a miniature light-emitting device. The miniature light-emitting structure comprises a substrate, an optical chip and a functional module, the substrate is provided with two opposite faces, and the optical chip is...
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| creator | CAI ZHENGYIN CAI WEN |
| description | The embodiment of the utility model discloses a miniature light-emitting structure and a miniature light-emitting device. The miniature light-emitting structure comprises a substrate, an optical chip and a functional module, the substrate is provided with two opposite faces, and the optical chip is arranged on one face of the substrate. The functional module is arranged on the other face, away from the optical chip, of the substrate, an electric connecting piece is arranged between the two faces of the substrate, and the optical chip and the functional module are electrically connected through the electric connecting piece. An electric connecting piece is arranged between two opposite mounting surfaces of a substrate, an optical chip and a functional module are respectively arranged on the two mounting surfaces, and the optical chip and the functional module are connected through the electric connecting piece. Compared with the prior art in which the optical chip and the functional module are respectively arr |
| format | Patent |
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The miniature light-emitting structure comprises a substrate, an optical chip and a functional module, the substrate is provided with two opposite faces, and the optical chip is arranged on one face of the substrate. The functional module is arranged on the other face, away from the optical chip, of the substrate, an electric connecting piece is arranged between the two faces of the substrate, and the optical chip and the functional module are electrically connected through the electric connecting piece. An electric connecting piece is arranged between two opposite mounting surfaces of a substrate, an optical chip and a functional module are respectively arranged on the two mounting surfaces, and the optical chip and the functional module are connected through the electric connecting piece. Compared with the prior art in which the optical chip and the functional module are respectively arr</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230818&DB=EPODOC&CC=CN&NR=219553668U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230818&DB=EPODOC&CC=CN&NR=219553668U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAI ZHENGYIN</creatorcontrib><creatorcontrib>CAI WEN</creatorcontrib><title>Miniature light-emitting structure and miniature light-emitting device</title><description>The embodiment of the utility model discloses a miniature light-emitting structure and a miniature light-emitting device. The miniature light-emitting structure comprises a substrate, an optical chip and a functional module, the substrate is provided with two opposite faces, and the optical chip is arranged on one face of the substrate. The functional module is arranged on the other face, away from the optical chip, of the substrate, an electric connecting piece is arranged between the two faces of the substrate, and the optical chip and the functional module are electrically connected through the electric connecting piece. An electric connecting piece is arranged between two opposite mounting surfaces of a substrate, an optical chip and a functional module are respectively arranged on the two mounting surfaces, and the optical chip and the functional module are connected through the electric connecting piece. Compared with the prior art in which the optical chip and the functional module are respectively arr</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDzzczLTCwpLUpVyMlMzyjRTc3NLCnJzEtXKC4pKk0GSyTmpSjk4lKWklqWmZzKw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvinf2MDC1NTY3NzCxCQ42JUgQA_Zw1Nw</recordid><startdate>20230818</startdate><enddate>20230818</enddate><creator>CAI ZHENGYIN</creator><creator>CAI WEN</creator><scope>EVB</scope></search><sort><creationdate>20230818</creationdate><title>Miniature light-emitting structure and miniature light-emitting device</title><author>CAI ZHENGYIN ; CAI WEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219553668UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CAI ZHENGYIN</creatorcontrib><creatorcontrib>CAI WEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAI ZHENGYIN</au><au>CAI WEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Miniature light-emitting structure and miniature light-emitting device</title><date>2023-08-18</date><risdate>2023</risdate><abstract>The embodiment of the utility model discloses a miniature light-emitting structure and a miniature light-emitting device. The miniature light-emitting structure comprises a substrate, an optical chip and a functional module, the substrate is provided with two opposite faces, and the optical chip is arranged on one face of the substrate. The functional module is arranged on the other face, away from the optical chip, of the substrate, an electric connecting piece is arranged between the two faces of the substrate, and the optical chip and the functional module are electrically connected through the electric connecting piece. An electric connecting piece is arranged between two opposite mounting surfaces of a substrate, an optical chip and a functional module are respectively arranged on the two mounting surfaces, and the optical chip and the functional module are connected through the electric connecting piece. Compared with the prior art in which the optical chip and the functional module are respectively arr</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Miniature light-emitting structure and miniature light-emitting device |
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