Wafer tray device
The utility model discloses a wafer tray device, comprising a tray main body and movable supports, the tray main body is provided with at least one wafer groove used for placing wafers and at least one support groove, each wafer groove corresponds to one or more support grooves, each support groove...
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| creator | XUE CONG ZHAI YONGPENG WANG SHUMIN DONG JIANRONG |
| description | The utility model discloses a wafer tray device, comprising a tray main body and movable supports, the tray main body is provided with at least one wafer groove used for placing wafers and at least one support groove, each wafer groove corresponds to one or more support grooves, each support groove is internally provided with a movable support, the movable supports are arranged around the wafer groove, and the movable supports are arranged around the wafer groove. The movable supports are rotationally arranged in the corresponding support grooves and rotate in the vertical direction. When a wafer is placed in the wafer groove, one end, close to the wafer, of the movable support is pressed down by the wafer, and the other end tilts and protrudes out of the upper surface of the tray body. When the manipulator clamping jaw presses down the other end of the movable support, one end, close to the wafer, of the movable support tilts, and the wafer is jacked into the manipulator clamping jaw for the manipulator to c |
| format | Patent |
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The movable supports are rotationally arranged in the corresponding support grooves and rotate in the vertical direction. When a wafer is placed in the wafer groove, one end, close to the wafer, of the movable support is pressed down by the wafer, and the other end tilts and protrudes out of the upper surface of the tray body. When the manipulator clamping jaw presses down the other end of the movable support, one end, close to the wafer, of the movable support tilts, and the wafer is jacked into the manipulator clamping jaw for the manipulator to c</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE ; APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CRYSTAL GROWTH ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE ; REFINING BY ZONE-MELTING OF MATERIAL ; SEMICONDUCTOR DEVICES ; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE ; SINGLE-CRYSTAL-GROWTH ; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230725&DB=EPODOC&CC=CN&NR=219409988U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230725&DB=EPODOC&CC=CN&NR=219409988U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XUE CONG</creatorcontrib><creatorcontrib>ZHAI YONGPENG</creatorcontrib><creatorcontrib>WANG SHUMIN</creatorcontrib><creatorcontrib>DONG JIANRONG</creatorcontrib><title>Wafer tray device</title><description>The utility model discloses a wafer tray device, comprising a tray main body and movable supports, the tray main body is provided with at least one wafer groove used for placing wafers and at least one support groove, each wafer groove corresponds to one or more support grooves, each support groove is internally provided with a movable support, the movable supports are arranged around the wafer groove, and the movable supports are arranged around the wafer groove. The movable supports are rotationally arranged in the corresponding support grooves and rotate in the vertical direction. When a wafer is placed in the wafer groove, one end, close to the wafer, of the movable support is pressed down by the wafer, and the other end tilts and protrudes out of the upper surface of the tray body. 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The movable supports are rotationally arranged in the corresponding support grooves and rotate in the vertical direction. When a wafer is placed in the wafer groove, one end, close to the wafer, of the movable support is pressed down by the wafer, and the other end tilts and protrudes out of the upper surface of the tray body. When the manipulator clamping jaw presses down the other end of the movable support, one end, close to the wafer, of the movable support tilts, and the wafer is jacked into the manipulator clamping jaw for the manipulator to c</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CRYSTAL GROWTH ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SEMICONDUCTOR DEVICES SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL |
| title | Wafer tray device |
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