Workpiece picking and attaching mechanism

Workpiece picking and attaching mechanism

The utility model relates to the technical field of workpiece picking and attaching, in particular to a workpiece picking and attaching mechanism. A pressure sensor is installed on the support, a spline shaft in the transmission assembly sequentially penetrates through the pressure sensor and the sp...

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Hauptverfasser: WANG JIANGKUN, ZHANG ANBING, GUO MENG, LIN XIANG, ZHOU DIANQIU
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WANG JIANGKUN
ZHANG ANBING
GUO MENG
LIN XIANG
ZHOU DIANQIU
description The utility model relates to the technical field of workpiece picking and attaching, in particular to a workpiece picking and attaching mechanism. A pressure sensor is installed on the support, a spline shaft in the transmission assembly sequentially penetrates through the pressure sensor and the spring assembly to be connected with the vacuum suction cup, a servo motor in the transmission assembly drives the spline shaft in the transmission assembly to rotate, the angle of the vacuum suction cup is adjusted, and the spline shaft generates relative displacement under stress during mounting. The compression spring assembly transmits pressure to the pressure sensor, the pressure sensor accurately controls the fitting pressure of the workpiece, and monitors and adjusts the pressure value of the vacuum chuck on the adsorbed workpiece in real time during fitting, so that the pressure control during fitting is realized, and the risk that the product is crushed in the assembly process is avoided while the process re
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Workpiece picking and attaching mechanism
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