Circuit board electroplating auxiliary tool and electroplating device
The utility model discloses a circuit board electroplating assistive device and discloses an electroplating device with the circuit board electroplating assistive device, the circuit board electroplating assistive device comprises a first fixing piece, a second fixing piece and a connecting piece, t...
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| creator | HE DENGSHENG LAI JUNCHONG CHEN MENG LIU HUILUN |
| description | The utility model discloses a circuit board electroplating assistive device and discloses an electroplating device with the circuit board electroplating assistive device, the circuit board electroplating assistive device comprises a first fixing piece, a second fixing piece and a connecting piece, the first fixing piece is used for fixing a circuit board; the second fixing piece is connected to the first fixing piece and provided with a first limiting groove facing the circuit board, and the first end of the circuit board can be inserted into the first limiting groove; one end of the connecting piece is connected to one side, far away from the second fixing piece, of the first fixing piece, the other end of the connecting piece can be connected to the hanger, the connecting piece is provided with a second limiting groove facing the circuit board, and the second end, far away from the first limiting groove, of the circuit board can be inserted into the second limiting groove. The lower end of the circuit board |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219260253UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219260253UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219260253UU3</originalsourceid><addsrcrecordid>eNrjZHB1zixKLs0sUUjKTyxKUUjNSU0uKcovyEksycxLV0gsrcjMyUwsqlQoyc_PUUjMw1CRklqWmZzKw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvinf2MDC2NzAyMTI1DQ42JUgQAsRg0qg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board electroplating auxiliary tool and electroplating device</title><source>esp@cenet</source><creator>HE DENGSHENG ; LAI JUNCHONG ; CHEN MENG ; LIU HUILUN</creator><creatorcontrib>HE DENGSHENG ; LAI JUNCHONG ; CHEN MENG ; LIU HUILUN</creatorcontrib><description>The utility model discloses a circuit board electroplating assistive device and discloses an electroplating device with the circuit board electroplating assistive device, the circuit board electroplating assistive device comprises a first fixing piece, a second fixing piece and a connecting piece, the first fixing piece is used for fixing a circuit board; the second fixing piece is connected to the first fixing piece and provided with a first limiting groove facing the circuit board, and the first end of the circuit board can be inserted into the first limiting groove; one end of the connecting piece is connected to one side, far away from the second fixing piece, of the first fixing piece, the other end of the connecting piece can be connected to the hanger, the connecting piece is provided with a second limiting groove facing the circuit board, and the second end, far away from the first limiting groove, of the circuit board can be inserted into the second limiting groove. The lower end of the circuit board</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230627&DB=EPODOC&CC=CN&NR=219260253U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230627&DB=EPODOC&CC=CN&NR=219260253U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HE DENGSHENG</creatorcontrib><creatorcontrib>LAI JUNCHONG</creatorcontrib><creatorcontrib>CHEN MENG</creatorcontrib><creatorcontrib>LIU HUILUN</creatorcontrib><title>Circuit board electroplating auxiliary tool and electroplating device</title><description>The utility model discloses a circuit board electroplating assistive device and discloses an electroplating device with the circuit board electroplating assistive device, the circuit board electroplating assistive device comprises a first fixing piece, a second fixing piece and a connecting piece, the first fixing piece is used for fixing a circuit board; the second fixing piece is connected to the first fixing piece and provided with a first limiting groove facing the circuit board, and the first end of the circuit board can be inserted into the first limiting groove; one end of the connecting piece is connected to one side, far away from the second fixing piece, of the first fixing piece, the other end of the connecting piece can be connected to the hanger, the connecting piece is provided with a second limiting groove facing the circuit board, and the second end, far away from the first limiting groove, of the circuit board can be inserted into the second limiting groove. The lower end of the circuit board</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1zixKLs0sUUjKTyxKUUjNSU0uKcovyEksycxLV0gsrcjMyUwsqlQoyc_PUUjMw1CRklqWmZzKw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvinf2MDC2NzAyMTI1DQ42JUgQAsRg0qg</recordid><startdate>20230627</startdate><enddate>20230627</enddate><creator>HE DENGSHENG</creator><creator>LAI JUNCHONG</creator><creator>CHEN MENG</creator><creator>LIU HUILUN</creator><scope>EVB</scope></search><sort><creationdate>20230627</creationdate><title>Circuit board electroplating auxiliary tool and electroplating device</title><author>HE DENGSHENG ; LAI JUNCHONG ; CHEN MENG ; LIU HUILUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219260253UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>HE DENGSHENG</creatorcontrib><creatorcontrib>LAI JUNCHONG</creatorcontrib><creatorcontrib>CHEN MENG</creatorcontrib><creatorcontrib>LIU HUILUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HE DENGSHENG</au><au>LAI JUNCHONG</au><au>CHEN MENG</au><au>LIU HUILUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board electroplating auxiliary tool and electroplating device</title><date>2023-06-27</date><risdate>2023</risdate><abstract>The utility model discloses a circuit board electroplating assistive device and discloses an electroplating device with the circuit board electroplating assistive device, the circuit board electroplating assistive device comprises a first fixing piece, a second fixing piece and a connecting piece, the first fixing piece is used for fixing a circuit board; the second fixing piece is connected to the first fixing piece and provided with a first limiting groove facing the circuit board, and the first end of the circuit board can be inserted into the first limiting groove; one end of the connecting piece is connected to one side, far away from the second fixing piece, of the first fixing piece, the other end of the connecting piece can be connected to the hanger, the connecting piece is provided with a second limiting groove facing the circuit board, and the second end, far away from the first limiting groove, of the circuit board can be inserted into the second limiting groove. The lower end of the circuit board</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN219260253UU |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Circuit board electroplating auxiliary tool and electroplating device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T18%3A20%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HE%20DENGSHENG&rft.date=2023-06-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN219260253UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |