BGA packaging production line

BGA packaging production line

The utility model discloses a BGA packaging production line, and relates to the field of packaging equipment.The BGA packaging production line comprises chip mounting equipment, wire bonding equipment and gluing equipment, the gluing equipment is fixedly connected with a heating table, the heating t...

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Hauptverfasser: PAN JIAN, BIAN LONG, ZHU DAHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PAN JIAN
BIAN LONG
ZHU DAHENG
description The utility model discloses a BGA packaging production line, and relates to the field of packaging equipment.The BGA packaging production line comprises chip mounting equipment, wire bonding equipment and gluing equipment, the gluing equipment is fixedly connected with a heating table, the heating table is fixedly connected with a heating piece used for heating the heating table, the heating table is fixedly connected with a fixing plate, and the fixing plate is fixedly connected with a fixing base; the gluing equipment comprises a heating table, adjusting plates are connected to the heating table in a sliding mode, sliding dampers are arranged at the connecting positions of the adjusting plates and the heating table, the number of the adjusting plates is two, the two adjusting plates are perpendicular to each other, a glue supply assembly is further arranged on the gluing equipment, and a heat dissipation piece is further arranged on the gluing equipment. The BGA chip packaging structure has the effects of f
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title BGA packaging production line
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