Anti-falling structure for chip packaging

The utility model discloses an anti-falling structure for chip packaging, which comprises a chip packaging and conveying assembly, a packaging, mounting and placing flat plate, a sliding groove opening formed in the inner side of the packaging, mounting and placing flat plate, and a groove frame mou...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAN AIJUN, LIU BING, WANG FANGWEI, SHANG JIANGUO, LIU YUEZU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!