Power tube mounting structure and interphone
The utility model relates to the technical field of power amplifiers, in particular to a mounting structure of a power tube and an interphone. The installation structure comprises a circuit board, a power tube and a heat dissipation block, the circuit board is provided with an installation hole site...
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creator | XU QINGLIN ZHUANG SHUIQING GUO XIAOFANG LIN WENYI WU ZHIXU XIE ZHENYUE YANG RENJUN CHEN QIZHAN |
description | The utility model relates to the technical field of power amplifiers, in particular to a mounting structure of a power tube and an interphone. The installation structure comprises a circuit board, a power tube and a heat dissipation block, the circuit board is provided with an installation hole site, a function bonding pad and a grounding bonding pad, the function bonding pad is located on the front face of the circuit board, the grounding bonding pad is arranged on the back face of the circuit board, and the power tube comprises a main tube body and a function pin. The main body tube body is arranged in the mounting hole position from the front surface direction of the circuit board, the function pin is in welded connection with the function bonding pad, the heat dissipation block is arranged at the mounting hole position from the back surface of the circuit board, the heat dissipation block is in welded connection with the source electrode pin, and the heat dissipation block is in welded connection with the |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219227990UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219227990UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219227990UU3</originalsourceid><addsrcrecordid>eNrjZNAJyC9PLVIoKU1KVcjNL80rycxLVyguKSpNLiktSlVIzEtRyMwrSS0qyMjPS-VhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGlkZG5paWBqGhxkQpAgAjTysn</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power tube mounting structure and interphone</title><source>esp@cenet</source><creator>XU QINGLIN ; ZHUANG SHUIQING ; GUO XIAOFANG ; LIN WENYI ; WU ZHIXU ; XIE ZHENYUE ; YANG RENJUN ; CHEN QIZHAN</creator><creatorcontrib>XU QINGLIN ; ZHUANG SHUIQING ; GUO XIAOFANG ; LIN WENYI ; WU ZHIXU ; XIE ZHENYUE ; YANG RENJUN ; CHEN QIZHAN</creatorcontrib><description>The utility model relates to the technical field of power amplifiers, in particular to a mounting structure of a power tube and an interphone. The installation structure comprises a circuit board, a power tube and a heat dissipation block, the circuit board is provided with an installation hole site, a function bonding pad and a grounding bonding pad, the function bonding pad is located on the front face of the circuit board, the grounding bonding pad is arranged on the back face of the circuit board, and the power tube comprises a main tube body and a function pin. The main body tube body is arranged in the mounting hole position from the front surface direction of the circuit board, the function pin is in welded connection with the function bonding pad, the heat dissipation block is arranged at the mounting hole position from the back surface of the circuit board, the heat dissipation block is in welded connection with the source electrode pin, and the heat dissipation block is in welded connection with the</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230620&DB=EPODOC&CC=CN&NR=219227990U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230620&DB=EPODOC&CC=CN&NR=219227990U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU QINGLIN</creatorcontrib><creatorcontrib>ZHUANG SHUIQING</creatorcontrib><creatorcontrib>GUO XIAOFANG</creatorcontrib><creatorcontrib>LIN WENYI</creatorcontrib><creatorcontrib>WU ZHIXU</creatorcontrib><creatorcontrib>XIE ZHENYUE</creatorcontrib><creatorcontrib>YANG RENJUN</creatorcontrib><creatorcontrib>CHEN QIZHAN</creatorcontrib><title>Power tube mounting structure and interphone</title><description>The utility model relates to the technical field of power amplifiers, in particular to a mounting structure of a power tube and an interphone. The installation structure comprises a circuit board, a power tube and a heat dissipation block, the circuit board is provided with an installation hole site, a function bonding pad and a grounding bonding pad, the function bonding pad is located on the front face of the circuit board, the grounding bonding pad is arranged on the back face of the circuit board, and the power tube comprises a main tube body and a function pin. The main body tube body is arranged in the mounting hole position from the front surface direction of the circuit board, the function pin is in welded connection with the function bonding pad, the heat dissipation block is arranged at the mounting hole position from the back surface of the circuit board, the heat dissipation block is in welded connection with the source electrode pin, and the heat dissipation block is in welded connection with the</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJyC9PLVIoKU1KVcjNL80rycxLVyguKSpNLiktSlVIzEtRyMwrSS0qyMjPS-VhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGlkZG5paWBqGhxkQpAgAjTysn</recordid><startdate>20230620</startdate><enddate>20230620</enddate><creator>XU QINGLIN</creator><creator>ZHUANG SHUIQING</creator><creator>GUO XIAOFANG</creator><creator>LIN WENYI</creator><creator>WU ZHIXU</creator><creator>XIE ZHENYUE</creator><creator>YANG RENJUN</creator><creator>CHEN QIZHAN</creator><scope>EVB</scope></search><sort><creationdate>20230620</creationdate><title>Power tube mounting structure and interphone</title><author>XU QINGLIN ; ZHUANG SHUIQING ; GUO XIAOFANG ; LIN WENYI ; WU ZHIXU ; XIE ZHENYUE ; YANG RENJUN ; CHEN QIZHAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219227990UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>XU QINGLIN</creatorcontrib><creatorcontrib>ZHUANG SHUIQING</creatorcontrib><creatorcontrib>GUO XIAOFANG</creatorcontrib><creatorcontrib>LIN WENYI</creatorcontrib><creatorcontrib>WU ZHIXU</creatorcontrib><creatorcontrib>XIE ZHENYUE</creatorcontrib><creatorcontrib>YANG RENJUN</creatorcontrib><creatorcontrib>CHEN QIZHAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU QINGLIN</au><au>ZHUANG SHUIQING</au><au>GUO XIAOFANG</au><au>LIN WENYI</au><au>WU ZHIXU</au><au>XIE ZHENYUE</au><au>YANG RENJUN</au><au>CHEN QIZHAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power tube mounting structure and interphone</title><date>2023-06-20</date><risdate>2023</risdate><abstract>The utility model relates to the technical field of power amplifiers, in particular to a mounting structure of a power tube and an interphone. The installation structure comprises a circuit board, a power tube and a heat dissipation block, the circuit board is provided with an installation hole site, a function bonding pad and a grounding bonding pad, the function bonding pad is located on the front face of the circuit board, the grounding bonding pad is arranged on the back face of the circuit board, and the power tube comprises a main tube body and a function pin. The main body tube body is arranged in the mounting hole position from the front surface direction of the circuit board, the function pin is in welded connection with the function bonding pad, the heat dissipation block is arranged at the mounting hole position from the back surface of the circuit board, the heat dissipation block is in welded connection with the source electrode pin, and the heat dissipation block is in welded connection with the</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Power tube mounting structure and interphone |
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