Shielding device with waterproof heat dissipation holes
The utility model discloses a shielding device provided with waterproof heat dissipation holes, comprising a bottom shell, the top of the bottom shell is covered with a top cover playing a sealing role, the edge of the inner wall of the top cover is connected with the bottom shell through screws to...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HUANG RIMAO ZHOU KANGCHENG |
| description | The utility model discloses a shielding device provided with waterproof heat dissipation holes, comprising a bottom shell, the top of the bottom shell is covered with a top cover playing a sealing role, the edge of the inner wall of the top cover is connected with the bottom shell through screws to form a detachable fixing structure, and the top cover is provided with first air outlet holes distributed in an array for discharging hot air; the heat conduction pipe is horizontally arranged on the inner side of the bottom shell, a supporting column of the bottom shell is arranged at the bottom of the heat conduction pipe in a sliding and penetrating mode, the top end of the supporting column is attached to the top of the inner wall of the heat conduction pipe to form a limiting supporting structure, and the heat conduction pipe is fixedly connected to the supporting column of the bottom shell through a screw; and the circuit board is attached to the upper surface of the heat conduction pipe. According to the shi |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN219204948UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN219204948UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN219204948UU3</originalsourceid><addsrcrecordid>eNrjZDAPzshMzUnJzEtXSEkty0xOVSjPLMlQKE8sSS0qKMrPT1PISE0sUUjJLC7OLEgsyczPU8jIz0kt5mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoaWRgYmliYWoaHGRCkCAGFlLzA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Shielding device with waterproof heat dissipation holes</title><source>esp@cenet</source><creator>HUANG RIMAO ; ZHOU KANGCHENG</creator><creatorcontrib>HUANG RIMAO ; ZHOU KANGCHENG</creatorcontrib><description>The utility model discloses a shielding device provided with waterproof heat dissipation holes, comprising a bottom shell, the top of the bottom shell is covered with a top cover playing a sealing role, the edge of the inner wall of the top cover is connected with the bottom shell through screws to form a detachable fixing structure, and the top cover is provided with first air outlet holes distributed in an array for discharging hot air; the heat conduction pipe is horizontally arranged on the inner side of the bottom shell, a supporting column of the bottom shell is arranged at the bottom of the heat conduction pipe in a sliding and penetrating mode, the top end of the supporting column is attached to the top of the inner wall of the heat conduction pipe to form a limiting supporting structure, and the heat conduction pipe is fixedly connected to the supporting column of the bottom shell through a screw; and the circuit board is attached to the upper surface of the heat conduction pipe. According to the shi</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; JAMMING OF COMMUNICATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SECRET COMMUNICATION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230616&DB=EPODOC&CC=CN&NR=219204948U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230616&DB=EPODOC&CC=CN&NR=219204948U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG RIMAO</creatorcontrib><creatorcontrib>ZHOU KANGCHENG</creatorcontrib><title>Shielding device with waterproof heat dissipation holes</title><description>The utility model discloses a shielding device provided with waterproof heat dissipation holes, comprising a bottom shell, the top of the bottom shell is covered with a top cover playing a sealing role, the edge of the inner wall of the top cover is connected with the bottom shell through screws to form a detachable fixing structure, and the top cover is provided with first air outlet holes distributed in an array for discharging hot air; the heat conduction pipe is horizontally arranged on the inner side of the bottom shell, a supporting column of the bottom shell is arranged at the bottom of the heat conduction pipe in a sliding and penetrating mode, the top end of the supporting column is attached to the top of the inner wall of the heat conduction pipe to form a limiting supporting structure, and the heat conduction pipe is fixedly connected to the supporting column of the bottom shell through a screw; and the circuit board is attached to the upper surface of the heat conduction pipe. According to the shi</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>JAMMING OF COMMUNICATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SECRET COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPzshMzUnJzEtXSEkty0xOVSjPLMlQKE8sSS0qKMrPT1PISE0sUUjJLC7OLEgsyczPU8jIz0kt5mFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoaWRgYmliYWoaHGRCkCAGFlLzA</recordid><startdate>20230616</startdate><enddate>20230616</enddate><creator>HUANG RIMAO</creator><creator>ZHOU KANGCHENG</creator><scope>EVB</scope></search><sort><creationdate>20230616</creationdate><title>Shielding device with waterproof heat dissipation holes</title><author>HUANG RIMAO ; ZHOU KANGCHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219204948UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>JAMMING OF COMMUNICATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SECRET COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG RIMAO</creatorcontrib><creatorcontrib>ZHOU KANGCHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG RIMAO</au><au>ZHOU KANGCHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Shielding device with waterproof heat dissipation holes</title><date>2023-06-16</date><risdate>2023</risdate><abstract>The utility model discloses a shielding device provided with waterproof heat dissipation holes, comprising a bottom shell, the top of the bottom shell is covered with a top cover playing a sealing role, the edge of the inner wall of the top cover is connected with the bottom shell through screws to form a detachable fixing structure, and the top cover is provided with first air outlet holes distributed in an array for discharging hot air; the heat conduction pipe is horizontally arranged on the inner side of the bottom shell, a supporting column of the bottom shell is arranged at the bottom of the heat conduction pipe in a sliding and penetrating mode, the top end of the supporting column is attached to the top of the inner wall of the heat conduction pipe to form a limiting supporting structure, and the heat conduction pipe is fixedly connected to the supporting column of the bottom shell through a screw; and the circuit board is attached to the upper surface of the heat conduction pipe. According to the shi</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN219204948UU |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY JAMMING OF COMMUNICATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SECRET COMMUNICATION |
| title | Shielding device with waterproof heat dissipation holes |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T02%3A47%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20RIMAO&rft.date=2023-06-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN219204948UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |