Heat treatment device
The utility model relates to a heat treatment device. Maintenance is improved. The heat treatment apparatus includes a heating portion, a bottom wall, a chamber, and a guide portion. The heating unit supports and heats the substrate to which the processing liquid has been supplied. The bottom wall s...
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| creator | KUGA YASUHIRO OSHIMA KAZUHIKO |
| description | The utility model relates to a heat treatment device. Maintenance is improved. The heat treatment apparatus includes a heating portion, a bottom wall, a chamber, and a guide portion. The heating unit supports and heats the substrate to which the processing liquid has been supplied. The bottom wall surrounds the substrate supported by the heating unit. The chamber comprises a top plate covering the heating part and a side wall arranged between the bottom wall and the top plate, and the chamber can be freely assembled and disassembled relative to the base part provided with the heating part. The guide portion guides movement of the chamber from a mounting position where the space in the chamber surrounds the substrate on the heating portion in a predetermined movable direction along the upper surface of the heating portion.
本实用新型涉及热处理装置。用于提高维护性。热处理装置包括加热部、底壁、腔室以及引导部。加热部支承被供给了处理液的基板并对其进行加热。底壁包围支承于加热部的基板。腔室包括覆盖加热部的顶板和设在底壁和顶板之间的侧壁，该腔室相对于设有加热部的基座部拆装自如。引导部在沿着加热部的上表面的规定的可动方向上，引导腔室从腔室内的空间包围加热部上的基板的安装位置起的移动。 |
| format | Patent |
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本实用新型涉及热处理装置。用于提高维护性。热处理装置包括加热部、底壁、腔室以及引导部。加热部支承被供给了处理液的基板并对其进行加热。底壁包围支承于加热部的基板。腔室包括覆盖加热部的顶板和设在底壁和顶板之间的侧壁，该腔室相对于设有加热部的基座部拆装自如。引导部在沿着加热部的上表面的规定的可动方向上，引导腔室从腔室内的空间包围加热部上的基板的安装位置起的移动。</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230526&DB=EPODOC&CC=CN&NR=219085938U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230526&DB=EPODOC&CC=CN&NR=219085938U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUGA YASUHIRO</creatorcontrib><creatorcontrib>OSHIMA KAZUHIKO</creatorcontrib><title>Heat treatment device</title><description>The utility model relates to a heat treatment device. Maintenance is improved. The heat treatment apparatus includes a heating portion, a bottom wall, a chamber, and a guide portion. The heating unit supports and heats the substrate to which the processing liquid has been supplied. The bottom wall surrounds the substrate supported by the heating unit. The chamber comprises a top plate covering the heating part and a side wall arranged between the bottom wall and the top plate, and the chamber can be freely assembled and disassembled relative to the base part provided with the heating part. The guide portion guides movement of the chamber from a mounting position where the space in the chamber surrounds the substrate on the heating portion in a predetermined movable direction along the upper surface of the heating portion.
本实用新型涉及热处理装置。用于提高维护性。热处理装置包括加热部、底壁、腔室以及引导部。加热部支承被供给了处理液的基板并对其进行加热。底壁包围支承于加热部的基板。腔室包括覆盖加热部的顶板和设在底壁和顶板之间的侧壁，该腔室相对于设有加热部的基座部拆装自如。引导部在沿着加热部的上表面的规定的可动方向上，引导腔室从腔室内的空间包围加热部上的基板的安装位置起的移动。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD1SE0sUSgpApK5qXklCimpZZnJqTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz8jQ0sDC1NLYIjTUmChFALSWIfA</recordid><startdate>20230526</startdate><enddate>20230526</enddate><creator>KUGA YASUHIRO</creator><creator>OSHIMA KAZUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20230526</creationdate><title>Heat treatment device</title><author>KUGA YASUHIRO ; OSHIMA KAZUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219085938UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUGA YASUHIRO</creatorcontrib><creatorcontrib>OSHIMA KAZUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUGA YASUHIRO</au><au>OSHIMA KAZUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat treatment device</title><date>2023-05-26</date><risdate>2023</risdate><abstract>The utility model relates to a heat treatment device. Maintenance is improved. The heat treatment apparatus includes a heating portion, a bottom wall, a chamber, and a guide portion. The heating unit supports and heats the substrate to which the processing liquid has been supplied. The bottom wall surrounds the substrate supported by the heating unit. The chamber comprises a top plate covering the heating part and a side wall arranged between the bottom wall and the top plate, and the chamber can be freely assembled and disassembled relative to the base part provided with the heating part. The guide portion guides movement of the chamber from a mounting position where the space in the chamber surrounds the substrate on the heating portion in a predetermined movable direction along the upper surface of the heating portion.
本实用新型涉及热处理装置。用于提高维护性。热处理装置包括加热部、底壁、腔室以及引导部。加热部支承被供给了处理液的基板并对其进行加热。底壁包围支承于加热部的基板。腔室包括覆盖加热部的顶板和设在底壁和顶板之间的侧壁，该腔室相对于设有加热部的基座部拆装自如。引导部在沿着加热部的上表面的规定的可动方向上，引导腔室从腔室内的空间包围加热部上的基板的安装位置起的移动。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | Heat treatment device |
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