PCB sinking groove process type air pressure sensor

The utility model discloses a PCB sinking groove technology type air pressure sensor which comprises a sinking groove circuit board, a shell and encapsulating glue, one end of the top of the shell is provided with an air suction hole, the top of the shell is fixedly provided with a waterproof net, o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHOU WEI, LIU SHANJIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a PCB sinking groove technology type air pressure sensor which comprises a sinking groove circuit board, a shell and encapsulating glue, one end of the top of the shell is provided with an air suction hole, the top of the shell is fixedly provided with a waterproof net, one end of the top of the sinking groove circuit board is provided with a micro-electro-mechanical sensor, and the other end of the top of the sinking groove circuit board is provided with a micro-electro-mechanical sensor. A capacitor is fixedly installed at the end, close to the micro-electro-mechanical sensor, of the top of the sinking groove circuit board, and a groove is formed in the end, away from the micro-electro-mechanical sensor, of the top of the sinking groove circuit board. According to the PCB sinking groove technology type air pressure sensor, the groove suitable for the size of a surface-mounted element is processed and sunk, then the ASIC suitable for conductive copper-platinum connection is formed