High-speed semiconductor video positioning laser marking machine
The utility model relates to the technical field of laser marking machines, and discloses a high-speed semiconductor video positioning laser marking machine which comprises a bottom plate and a vertical plate, the vertical plate is fixedly arranged on one side of the upper surface of the bottom plat...
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creator | LI HAOSHEN LEE YE-RANG YAN GUO |
description | The utility model relates to the technical field of laser marking machines, and discloses a high-speed semiconductor video positioning laser marking machine which comprises a bottom plate and a vertical plate, the vertical plate is fixedly arranged on one side of the upper surface of the bottom plate, a top plate is fixedly arranged at the top end of the vertical plate, and a conveying belt is arranged on the upper surface of the bottom plate. A high-speed laser marking machine is arranged on the lower surface of the top plate and located above the conveying belt, a visual monitoring camera is arranged on one side of the high-speed laser marking machine, a filter shell is arranged at the top of the top plate, and an adsorption plate and a filter plate are sequentially arranged in the filter shell from top to bottom. An exhaust pipe is fixedly arranged on the lower side of the filter shell, an exhaust pipe is arranged on the lower side of the exhaust pipe, and a through groove is formed in the upper side of th |
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A high-speed laser marking machine is arranged on the lower surface of the top plate and located above the conveying belt, a visual monitoring camera is arranged on one side of the high-speed laser marking machine, a filter shell is arranged at the top of the top plate, and an adsorption plate and a filter plate are sequentially arranged in the filter shell from top to bottom. An exhaust pipe is fixedly arranged on the lower side of the filter shell, an exhaust pipe is arranged on the lower side of the exhaust pipe, and a through groove is formed in the upper side of th</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230516&DB=EPODOC&CC=CN&NR=219026311U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230516&DB=EPODOC&CC=CN&NR=219026311U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI HAOSHEN</creatorcontrib><creatorcontrib>LEE YE-RANG</creatorcontrib><creatorcontrib>YAN GUO</creatorcontrib><title>High-speed semiconductor video positioning laser marking machine</title><description>The utility model relates to the technical field of laser marking machines, and discloses a high-speed semiconductor video positioning laser marking machine which comprises a bottom plate and a vertical plate, the vertical plate is fixedly arranged on one side of the upper surface of the bottom plate, a top plate is fixedly arranged at the top end of the vertical plate, and a conveying belt is arranged on the upper surface of the bottom plate. A high-speed laser marking machine is arranged on the lower surface of the top plate and located above the conveying belt, a visual monitoring camera is arranged on one side of the high-speed laser marking machine, a filter shell is arranged at the top of the top plate, and an adsorption plate and a filter plate are sequentially arranged in the filter shell from top to bottom. An exhaust pipe is fixedly arranged on the lower side of the filter shell, an exhaust pipe is arranged on the lower side of the exhaust pipe, and a through groove is formed in the upper side of th</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDwyEzP0C0uSE1NUShOzc1Mzs9LKU0uyS9SKMtMSc1XKMgvzizJzM_LzEtXyEksTi1SyE0sygbxchOTMzLzUnkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhpYGRmbGhYWioMVGKAGuZMok</recordid><startdate>20230516</startdate><enddate>20230516</enddate><creator>LI HAOSHEN</creator><creator>LEE YE-RANG</creator><creator>YAN GUO</creator><scope>EVB</scope></search><sort><creationdate>20230516</creationdate><title>High-speed semiconductor video positioning laser marking machine</title><author>LI HAOSHEN ; LEE YE-RANG ; YAN GUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN219026311UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>LI HAOSHEN</creatorcontrib><creatorcontrib>LEE YE-RANG</creatorcontrib><creatorcontrib>YAN GUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI HAOSHEN</au><au>LEE YE-RANG</au><au>YAN GUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-speed semiconductor video positioning laser marking machine</title><date>2023-05-16</date><risdate>2023</risdate><abstract>The utility model relates to the technical field of laser marking machines, and discloses a high-speed semiconductor video positioning laser marking machine which comprises a bottom plate and a vertical plate, the vertical plate is fixedly arranged on one side of the upper surface of the bottom plate, a top plate is fixedly arranged at the top end of the vertical plate, and a conveying belt is arranged on the upper surface of the bottom plate. A high-speed laser marking machine is arranged on the lower surface of the top plate and located above the conveying belt, a visual monitoring camera is arranged on one side of the high-speed laser marking machine, a filter shell is arranged at the top of the top plate, and an adsorption plate and a filter plate are sequentially arranged in the filter shell from top to bottom. An exhaust pipe is fixedly arranged on the lower side of the filter shell, an exhaust pipe is arranged on the lower side of the exhaust pipe, and a through groove is formed in the upper side of th</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
title | High-speed semiconductor video positioning laser marking machine |
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