Electronic device packaging structure

The utility model provides an electronic device packaging structure. The electronic device packaging structure comprises a heat dissipation plate, an electronic device and insulating heat-conducting glue. The electronic device is arranged on the heat dissipation plate, and the heat dissipation plate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUO LIANGYIN, CHEN YATI, CHO JIHO, GAN SHAOPENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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