Electronic device packaging structure

Electronic device packaging structure

The utility model provides an electronic device packaging structure. The electronic device packaging structure comprises a heat dissipation plate, an electronic device and insulating heat-conducting glue. The electronic device is arranged on the heat dissipation plate, and the heat dissipation plate...

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Hauptverfasser: GUO LIANGYIN, CHEN YATI, CHO JIHO, GAN SHAOPENG
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator GUO LIANGYIN
CHEN YATI
CHO JIHO
GAN SHAOPENG
description The utility model provides an electronic device packaging structure. The electronic device packaging structure comprises a heat dissipation plate, an electronic device and insulating heat-conducting glue. The electronic device is arranged on the heat dissipation plate, and the heat dissipation plate is used for dissipating heat of the electronic device. The insulating heat-conducting glue is used for sealing and wrapping the electronic device, and at least covers the surface, which is not opposite to the heat dissipation plate, of the electronic device and a preset area, which surrounds the electronic device, of the heat dissipation plate. According to the electronic device packaging structure provided by the invention, the electronic device is directly arranged on the heat dissipation plate, and the electronic device is wrapped and covered by the insulating heat-conducting glue, so that the heat generated by the electronic device can be transmitted to the heat dissipation plate through the insulating heat-co
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218998649UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218998649UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218998649UU3</originalsourceid><addsrcrecordid>eNrjZFB1zUlNLinKz8tMVkhJLctMTlUoSEzOTkzPzEtXKC4pKk0uKS1K5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcVAHal5qSXxzn5GhhaWlhZmJpahocZEKQIAuEcofg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic device packaging structure</title><source>esp@cenet</source><creator>GUO LIANGYIN ; CHEN YATI ; CHO JIHO ; GAN SHAOPENG</creator><creatorcontrib>GUO LIANGYIN ; CHEN YATI ; CHO JIHO ; GAN SHAOPENG</creatorcontrib><description>The utility model provides an electronic device packaging structure. The electronic device packaging structure comprises a heat dissipation plate, an electronic device and insulating heat-conducting glue. The electronic device is arranged on the heat dissipation plate, and the heat dissipation plate is used for dissipating heat of the electronic device. The insulating heat-conducting glue is used for sealing and wrapping the electronic device, and at least covers the surface, which is not opposite to the heat dissipation plate, of the electronic device and a preset area, which surrounds the electronic device, of the heat dissipation plate. According to the electronic device packaging structure provided by the invention, the electronic device is directly arranged on the heat dissipation plate, and the electronic device is wrapped and covered by the insulating heat-conducting glue, so that the heat generated by the electronic device can be transmitted to the heat dissipation plate through the insulating heat-co</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230509&amp;DB=EPODOC&amp;CC=CN&amp;NR=218998649U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230509&amp;DB=EPODOC&amp;CC=CN&amp;NR=218998649U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUO LIANGYIN</creatorcontrib><creatorcontrib>CHEN YATI</creatorcontrib><creatorcontrib>CHO JIHO</creatorcontrib><creatorcontrib>GAN SHAOPENG</creatorcontrib><title>Electronic device packaging structure</title><description>The utility model provides an electronic device packaging structure. The electronic device packaging structure comprises a heat dissipation plate, an electronic device and insulating heat-conducting glue. The electronic device is arranged on the heat dissipation plate, and the heat dissipation plate is used for dissipating heat of the electronic device. The insulating heat-conducting glue is used for sealing and wrapping the electronic device, and at least covers the surface, which is not opposite to the heat dissipation plate, of the electronic device and a preset area, which surrounds the electronic device, of the heat dissipation plate. According to the electronic device packaging structure provided by the invention, the electronic device is directly arranged on the heat dissipation plate, and the electronic device is wrapped and covered by the insulating heat-conducting glue, so that the heat generated by the electronic device can be transmitted to the heat dissipation plate through the insulating heat-co</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB1zUlNLinKz8tMVkhJLctMTlUoSEzOTkzPzEtXKC4pKk0uKS1K5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcVAHal5qSXxzn5GhhaWlhZmJpahocZEKQIAuEcofg</recordid><startdate>20230509</startdate><enddate>20230509</enddate><creator>GUO LIANGYIN</creator><creator>CHEN YATI</creator><creator>CHO JIHO</creator><creator>GAN SHAOPENG</creator><scope>EVB</scope></search><sort><creationdate>20230509</creationdate><title>Electronic device packaging structure</title><author>GUO LIANGYIN ; CHEN YATI ; CHO JIHO ; GAN SHAOPENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218998649UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>GUO LIANGYIN</creatorcontrib><creatorcontrib>CHEN YATI</creatorcontrib><creatorcontrib>CHO JIHO</creatorcontrib><creatorcontrib>GAN SHAOPENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUO LIANGYIN</au><au>CHEN YATI</au><au>CHO JIHO</au><au>GAN SHAOPENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic device packaging structure</title><date>2023-05-09</date><risdate>2023</risdate><abstract>The utility model provides an electronic device packaging structure. The electronic device packaging structure comprises a heat dissipation plate, an electronic device and insulating heat-conducting glue. The electronic device is arranged on the heat dissipation plate, and the heat dissipation plate is used for dissipating heat of the electronic device. The insulating heat-conducting glue is used for sealing and wrapping the electronic device, and at least covers the surface, which is not opposite to the heat dissipation plate, of the electronic device and a preset area, which surrounds the electronic device, of the heat dissipation plate. According to the electronic device packaging structure provided by the invention, the electronic device is directly arranged on the heat dissipation plate, and the electronic device is wrapped and covered by the insulating heat-conducting glue, so that the heat generated by the electronic device can be transmitted to the heat dissipation plate through the insulating heat-co</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Electronic device packaging structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T14%3A16%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GUO%20LIANGYIN&rft.date=2023-05-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218998649UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true