LED packaging structure with high light-emitting consistency
The utility model relates to an LED packaging structure with high light-emitting consistency, and the structure comprises a lamp bead support which is provided with three independent cup grooves which are used for accommodating a red light chip, a blue light chip, and a green light chip. The full-co...
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creator | XIE ZONGXIAN WANG RENKAI LI BIBO |
description | The utility model relates to an LED packaging structure with high light-emitting consistency, and the structure comprises a lamp bead support which is provided with three independent cup grooves which are used for accommodating a red light chip, a blue light chip, and a green light chip. The full-color lamp bead comprises a red light chip, a blue light chip and a green light chip which are located in the independent cup grooves respectively, and the top surfaces of the red light chip, the blue light chip and the green light chip are flush; and the plurality of lamp bead bonding pads are respectively positioned in the independent cup grooves and are respectively connected with the red light chip, the blue light chip and the green light chip. According to the LED lamp bead, the lamp bead can be observed at different angles, the light emitting angle of each kind of light is consistent, the chromatic aberration of the lamp bead is reduced, the top surfaces of the red light chip, the blue light chip and the green |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218887217UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218887217UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218887217UU3</originalsourceid><addsrcrecordid>eNrjZLDxcXVRKEhMzk5Mz8xLVyguKSpNLiktSlUozyzJUMjITM9QyAESJbqpuZklJSAlyfl5xZnFJal5yZU8DKxpiTnFqbxQmptByc01xNlDN7UgPz61GGhsal5qSbyzn5GhhYWFuZGheWioMVGKAFa6MO4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LED packaging structure with high light-emitting consistency</title><source>esp@cenet</source><creator>XIE ZONGXIAN ; WANG RENKAI ; LI BIBO</creator><creatorcontrib>XIE ZONGXIAN ; WANG RENKAI ; LI BIBO</creatorcontrib><description>The utility model relates to an LED packaging structure with high light-emitting consistency, and the structure comprises a lamp bead support which is provided with three independent cup grooves which are used for accommodating a red light chip, a blue light chip, and a green light chip. The full-color lamp bead comprises a red light chip, a blue light chip and a green light chip which are located in the independent cup grooves respectively, and the top surfaces of the red light chip, the blue light chip and the green light chip are flush; and the plurality of lamp bead bonding pads are respectively positioned in the independent cup grooves and are respectively connected with the red light chip, the blue light chip and the green light chip. According to the LED lamp bead, the lamp bead can be observed at different angles, the light emitting angle of each kind of light is consistent, the chromatic aberration of the lamp bead is reduced, the top surfaces of the red light chip, the blue light chip and the green</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230418&DB=EPODOC&CC=CN&NR=218887217U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230418&DB=EPODOC&CC=CN&NR=218887217U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIE ZONGXIAN</creatorcontrib><creatorcontrib>WANG RENKAI</creatorcontrib><creatorcontrib>LI BIBO</creatorcontrib><title>LED packaging structure with high light-emitting consistency</title><description>The utility model relates to an LED packaging structure with high light-emitting consistency, and the structure comprises a lamp bead support which is provided with three independent cup grooves which are used for accommodating a red light chip, a blue light chip, and a green light chip. The full-color lamp bead comprises a red light chip, a blue light chip and a green light chip which are located in the independent cup grooves respectively, and the top surfaces of the red light chip, the blue light chip and the green light chip are flush; and the plurality of lamp bead bonding pads are respectively positioned in the independent cup grooves and are respectively connected with the red light chip, the blue light chip and the green light chip. According to the LED lamp bead, the lamp bead can be observed at different angles, the light emitting angle of each kind of light is consistent, the chromatic aberration of the lamp bead is reduced, the top surfaces of the red light chip, the blue light chip and the green</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDxcXVRKEhMzk5Mz8xLVyguKSpNLiktSlUozyzJUMjITM9QyAESJbqpuZklJSAlyfl5xZnFJal5yZU8DKxpiTnFqbxQmptByc01xNlDN7UgPz61GGhsal5qSbyzn5GhhYWFuZGheWioMVGKAFa6MO4</recordid><startdate>20230418</startdate><enddate>20230418</enddate><creator>XIE ZONGXIAN</creator><creator>WANG RENKAI</creator><creator>LI BIBO</creator><scope>EVB</scope></search><sort><creationdate>20230418</creationdate><title>LED packaging structure with high light-emitting consistency</title><author>XIE ZONGXIAN ; WANG RENKAI ; LI BIBO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218887217UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XIE ZONGXIAN</creatorcontrib><creatorcontrib>WANG RENKAI</creatorcontrib><creatorcontrib>LI BIBO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIE ZONGXIAN</au><au>WANG RENKAI</au><au>LI BIBO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED packaging structure with high light-emitting consistency</title><date>2023-04-18</date><risdate>2023</risdate><abstract>The utility model relates to an LED packaging structure with high light-emitting consistency, and the structure comprises a lamp bead support which is provided with three independent cup grooves which are used for accommodating a red light chip, a blue light chip, and a green light chip. The full-color lamp bead comprises a red light chip, a blue light chip and a green light chip which are located in the independent cup grooves respectively, and the top surfaces of the red light chip, the blue light chip and the green light chip are flush; and the plurality of lamp bead bonding pads are respectively positioned in the independent cup grooves and are respectively connected with the red light chip, the blue light chip and the green light chip. According to the LED lamp bead, the lamp bead can be observed at different angles, the light emitting angle of each kind of light is consistent, the chromatic aberration of the lamp bead is reduced, the top surfaces of the red light chip, the blue light chip and the green</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | LED packaging structure with high light-emitting consistency |
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