Light-emitting chip anti-falling structure and LED lamp bead thereof

Light-emitting chip anti-falling structure and LED lamp bead thereof

The utility model relates to a light-emitting chip anti-drop structure and an LED lamp bead thereof, the light-emitting chip anti-drop structure comprises a base and a chip which are connected through a metal conductive layer, the peripheral side of the metal conductive layer is provided with a conn...

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Hauptverfasser: LI GUOQIANG, DENG ZHI, FENG YONGXIONG, QIAN ZHENGJUN, LYU JINLUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LI GUOQIANG
DENG ZHI
FENG YONGXIONG
QIAN ZHENGJUN
LYU JINLUAN
description The utility model relates to a light-emitting chip anti-drop structure and an LED lamp bead thereof, the light-emitting chip anti-drop structure comprises a base and a chip which are connected through a metal conductive layer, the peripheral side of the metal conductive layer is provided with a connecting convex part, the connecting convex part is embedded in the base, the connecting and combining path of the metal conductive layer and the base is increased, the combining strength is enhanced, and the chip and the base are not easy to separate; the connecting convex part is annular, the base is correspondingly provided with an annular groove, and the annular connecting convex part can effectively reduce the hidden danger of water vapor invasion; the base is provided with a light condensation groove used for installing a chip, and the metal conductive layer is arranged at the inner bottom of the light condensation groove. A grouting groove for containing the metal conductive layer is formed in the inner bottom
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218498090UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218498090UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218498090UU3</originalsourceid><addsrcrecordid>eNrjZHDxyUzPKNFNzc0sKcnMS1dIzsgsUEjMK8nUTUvMyQGJFJcUlSaXlBalAoVTFHxcXRRyEnMLFJJSE1MUSjJSi1Lz03gYWIGqi1N5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvLOfkaGFiaWFgaVBaKgxUYoA37wzDQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light-emitting chip anti-falling structure and LED lamp bead thereof</title><source>esp@cenet</source><creator>LI GUOQIANG ; DENG ZHI ; FENG YONGXIONG ; QIAN ZHENGJUN ; LYU JINLUAN</creator><creatorcontrib>LI GUOQIANG ; DENG ZHI ; FENG YONGXIONG ; QIAN ZHENGJUN ; LYU JINLUAN</creatorcontrib><description>The utility model relates to a light-emitting chip anti-drop structure and an LED lamp bead thereof, the light-emitting chip anti-drop structure comprises a base and a chip which are connected through a metal conductive layer, the peripheral side of the metal conductive layer is provided with a connecting convex part, the connecting convex part is embedded in the base, the connecting and combining path of the metal conductive layer and the base is increased, the combining strength is enhanced, and the chip and the base are not easy to separate; the connecting convex part is annular, the base is correspondingly provided with an annular groove, and the annular connecting convex part can effectively reduce the hidden danger of water vapor invasion; the base is provided with a light condensation groove used for installing a chip, and the metal conductive layer is arranged at the inner bottom of the light condensation groove. A grouting groove for containing the metal conductive layer is formed in the inner bottom</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230217&amp;DB=EPODOC&amp;CC=CN&amp;NR=218498090U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230217&amp;DB=EPODOC&amp;CC=CN&amp;NR=218498090U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI GUOQIANG</creatorcontrib><creatorcontrib>DENG ZHI</creatorcontrib><creatorcontrib>FENG YONGXIONG</creatorcontrib><creatorcontrib>QIAN ZHENGJUN</creatorcontrib><creatorcontrib>LYU JINLUAN</creatorcontrib><title>Light-emitting chip anti-falling structure and LED lamp bead thereof</title><description>The utility model relates to a light-emitting chip anti-drop structure and an LED lamp bead thereof, the light-emitting chip anti-drop structure comprises a base and a chip which are connected through a metal conductive layer, the peripheral side of the metal conductive layer is provided with a connecting convex part, the connecting convex part is embedded in the base, the connecting and combining path of the metal conductive layer and the base is increased, the combining strength is enhanced, and the chip and the base are not easy to separate; the connecting convex part is annular, the base is correspondingly provided with an annular groove, and the annular connecting convex part can effectively reduce the hidden danger of water vapor invasion; the base is provided with a light condensation groove used for installing a chip, and the metal conductive layer is arranged at the inner bottom of the light condensation groove. A grouting groove for containing the metal conductive layer is formed in the inner bottom</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxyUzPKNFNzc0sKcnMS1dIzsgsUEjMK8nUTUvMyQGJFJcUlSaXlBalAoVTFHxcXRRyEnMLFJJSE1MUSjJSi1Lz03gYWIGqi1N5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvLOfkaGFiaWFgaVBaKgxUYoA37wzDQ</recordid><startdate>20230217</startdate><enddate>20230217</enddate><creator>LI GUOQIANG</creator><creator>DENG ZHI</creator><creator>FENG YONGXIONG</creator><creator>QIAN ZHENGJUN</creator><creator>LYU JINLUAN</creator><scope>EVB</scope></search><sort><creationdate>20230217</creationdate><title>Light-emitting chip anti-falling structure and LED lamp bead thereof</title><author>LI GUOQIANG ; DENG ZHI ; FENG YONGXIONG ; QIAN ZHENGJUN ; LYU JINLUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218498090UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LI GUOQIANG</creatorcontrib><creatorcontrib>DENG ZHI</creatorcontrib><creatorcontrib>FENG YONGXIONG</creatorcontrib><creatorcontrib>QIAN ZHENGJUN</creatorcontrib><creatorcontrib>LYU JINLUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI GUOQIANG</au><au>DENG ZHI</au><au>FENG YONGXIONG</au><au>QIAN ZHENGJUN</au><au>LYU JINLUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light-emitting chip anti-falling structure and LED lamp bead thereof</title><date>2023-02-17</date><risdate>2023</risdate><abstract>The utility model relates to a light-emitting chip anti-drop structure and an LED lamp bead thereof, the light-emitting chip anti-drop structure comprises a base and a chip which are connected through a metal conductive layer, the peripheral side of the metal conductive layer is provided with a connecting convex part, the connecting convex part is embedded in the base, the connecting and combining path of the metal conductive layer and the base is increased, the combining strength is enhanced, and the chip and the base are not easy to separate; the connecting convex part is annular, the base is correspondingly provided with an annular groove, and the annular connecting convex part can effectively reduce the hidden danger of water vapor invasion; the base is provided with a light condensation groove used for installing a chip, and the metal conductive layer is arranged at the inner bottom of the light condensation groove. A grouting groove for containing the metal conductive layer is formed in the inner bottom</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light-emitting chip anti-falling structure and LED lamp bead thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T18%3A35%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI%20GUOQIANG&rft.date=2023-02-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218498090UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true