Protective LED lead frame

Protective LED lead frame

The utility model discloses a protection type LED lead frame, which belongs to the technical field of LEDs, the LED lead frame is a matching part of the LEDs, and the lead frame of small devices such as the LEDs is mainly manufactured in two modes, one mode is that the lead frame is manufactured thr...

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Hauptverfasser: RAO JIAPING, HUANG PING, LIAO DAXIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator RAO JIAPING
HUANG PING
LIAO DAXIN
description The utility model discloses a protection type LED lead frame, which belongs to the technical field of LEDs, the LED lead frame is a matching part of the LEDs, and the lead frame of small devices such as the LEDs is mainly manufactured in two modes, one mode is that the lead frame is manufactured through etching, and the other mode is that the lead frame is manufactured through stamping. According to the utility model, through the arrangement of the lead frame assembly, the use position of the light-emitting diode can be installed and fixed, the leads of the light-emitting diode can be orderly arranged through the carding plate so as to prevent the heating condition caused by lead aggregation, and the bottom of each group of positioning grooves is provided with the heat dissipation grooves in a matched manner, so that the heat dissipation effect can be improved; according to the device, a certain gap exists between the carding plate and the PCB, heat dissipation can be facilitated, the lead frame assembly is i
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According to the utility model, through the arrangement of the lead frame assembly, the use position of the light-emitting diode can be installed and fixed, the leads of the light-emitting diode can be orderly arranged through the carding plate so as to prevent the heating condition caused by lead aggregation, and the bottom of each group of positioning grooves is provided with the heat dissipation grooves in a matched manner, so that the heat dissipation effect can be improved; according to the device, a certain gap exists between the carding plate and the PCB, heat dissipation can be facilitated, the lead frame assembly is i</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230217&amp;DB=EPODOC&amp;CC=CN&amp;NR=218498071U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230217&amp;DB=EPODOC&amp;CC=CN&amp;NR=218498071U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAO JIAPING</creatorcontrib><creatorcontrib>HUANG PING</creatorcontrib><creatorcontrib>LIAO DAXIN</creatorcontrib><title>Protective LED lead frame</title><description>The utility model discloses a protection type LED lead frame, which belongs to the technical field of LEDs, the LED lead frame is a matching part of the LEDs, and the lead frame of small devices such as the LEDs is mainly manufactured in two modes, one mode is that the lead frame is manufactured through etching, and the other mode is that the lead frame is manufactured through stamping. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Protective LED lead frame
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