Ejector pin mechanism and semiconductor processing equipment
The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being pl...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | YU JUNHUA HE QINGMING LU JINZHOU LIU YOUYUE GAO YUNFENG CHEN XUEKUI LUO ZHINING YIN JIANGANG NI JUNXIN |
description | The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being placed on the top cap assembly, a thin film material is attached to the surface of the product, and the top cap assembly is suitable for adsorbing the thin film material; the top cap assembly is suitable for driving the film material to move in the direction away from the product so as to achieve separation of the product and the film material. A product is placed on the top cap assembly, the external adsorption mechanism moves towards the product to adsorb the product, meanwhile, the ejector pin assembly ejects out to fix the product, the top cap assembly sucks a thin film material, the thin film material moves in the direction away from the product, and demolding of the product is achieved. And in the demolding pro |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218482267UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218482267UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218482267UU3</originalsourceid><addsrcrecordid>eNrjZLBxzUpNLskvUijIzFPITU3OSMzLLM5VSMxLUShOzc1Mzs9LKYXIF-UnpxYXZ-alK6QWlmYW5KbmlfAwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknhnPyNDCxMLIyMz89BQY6IUAQCQfDFW</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Ejector pin mechanism and semiconductor processing equipment</title><source>esp@cenet</source><creator>YU JUNHUA ; HE QINGMING ; LU JINZHOU ; LIU YOUYUE ; GAO YUNFENG ; CHEN XUEKUI ; LUO ZHINING ; YIN JIANGANG ; NI JUNXIN</creator><creatorcontrib>YU JUNHUA ; HE QINGMING ; LU JINZHOU ; LIU YOUYUE ; GAO YUNFENG ; CHEN XUEKUI ; LUO ZHINING ; YIN JIANGANG ; NI JUNXIN</creatorcontrib><description>The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being placed on the top cap assembly, a thin film material is attached to the surface of the product, and the top cap assembly is suitable for adsorbing the thin film material; the top cap assembly is suitable for driving the film material to move in the direction away from the product so as to achieve separation of the product and the film material. A product is placed on the top cap assembly, the external adsorption mechanism moves towards the product to adsorb the product, meanwhile, the ejector pin assembly ejects out to fix the product, the top cap assembly sucks a thin film material, the thin film material moves in the direction away from the product, and demolding of the product is achieved. And in the demolding pro</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230214&DB=EPODOC&CC=CN&NR=218482267U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230214&DB=EPODOC&CC=CN&NR=218482267U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YU JUNHUA</creatorcontrib><creatorcontrib>HE QINGMING</creatorcontrib><creatorcontrib>LU JINZHOU</creatorcontrib><creatorcontrib>LIU YOUYUE</creatorcontrib><creatorcontrib>GAO YUNFENG</creatorcontrib><creatorcontrib>CHEN XUEKUI</creatorcontrib><creatorcontrib>LUO ZHINING</creatorcontrib><creatorcontrib>YIN JIANGANG</creatorcontrib><creatorcontrib>NI JUNXIN</creatorcontrib><title>Ejector pin mechanism and semiconductor processing equipment</title><description>The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being placed on the top cap assembly, a thin film material is attached to the surface of the product, and the top cap assembly is suitable for adsorbing the thin film material; the top cap assembly is suitable for driving the film material to move in the direction away from the product so as to achieve separation of the product and the film material. A product is placed on the top cap assembly, the external adsorption mechanism moves towards the product to adsorb the product, meanwhile, the ejector pin assembly ejects out to fix the product, the top cap assembly sucks a thin film material, the thin film material moves in the direction away from the product, and demolding of the product is achieved. And in the demolding pro</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxzUpNLskvUijIzFPITU3OSMzLLM5VSMxLUShOzc1Mzs9LKYXIF-UnpxYXZ-alK6QWlmYW5KbmlfAwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknhnPyNDCxMLIyMz89BQY6IUAQCQfDFW</recordid><startdate>20230214</startdate><enddate>20230214</enddate><creator>YU JUNHUA</creator><creator>HE QINGMING</creator><creator>LU JINZHOU</creator><creator>LIU YOUYUE</creator><creator>GAO YUNFENG</creator><creator>CHEN XUEKUI</creator><creator>LUO ZHINING</creator><creator>YIN JIANGANG</creator><creator>NI JUNXIN</creator><scope>EVB</scope></search><sort><creationdate>20230214</creationdate><title>Ejector pin mechanism and semiconductor processing equipment</title><author>YU JUNHUA ; HE QINGMING ; LU JINZHOU ; LIU YOUYUE ; GAO YUNFENG ; CHEN XUEKUI ; LUO ZHINING ; YIN JIANGANG ; NI JUNXIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218482267UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YU JUNHUA</creatorcontrib><creatorcontrib>HE QINGMING</creatorcontrib><creatorcontrib>LU JINZHOU</creatorcontrib><creatorcontrib>LIU YOUYUE</creatorcontrib><creatorcontrib>GAO YUNFENG</creatorcontrib><creatorcontrib>CHEN XUEKUI</creatorcontrib><creatorcontrib>LUO ZHINING</creatorcontrib><creatorcontrib>YIN JIANGANG</creatorcontrib><creatorcontrib>NI JUNXIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YU JUNHUA</au><au>HE QINGMING</au><au>LU JINZHOU</au><au>LIU YOUYUE</au><au>GAO YUNFENG</au><au>CHEN XUEKUI</au><au>LUO ZHINING</au><au>YIN JIANGANG</au><au>NI JUNXIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ejector pin mechanism and semiconductor processing equipment</title><date>2023-02-14</date><risdate>2023</risdate><abstract>The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being placed on the top cap assembly, a thin film material is attached to the surface of the product, and the top cap assembly is suitable for adsorbing the thin film material; the top cap assembly is suitable for driving the film material to move in the direction away from the product so as to achieve separation of the product and the film material. A product is placed on the top cap assembly, the external adsorption mechanism moves towards the product to adsorb the product, meanwhile, the ejector pin assembly ejects out to fix the product, the top cap assembly sucks a thin film material, the thin film material moves in the direction away from the product, and demolding of the product is achieved. And in the demolding pro</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN218482267UU |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Ejector pin mechanism and semiconductor processing equipment |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T04%3A13%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YU%20JUNHUA&rft.date=2023-02-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218482267UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |