Ejector pin mechanism and semiconductor processing equipment

The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being pl...

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Hauptverfasser: YU JUNHUA, HE QINGMING, LU JINZHOU, LIU YOUYUE, GAO YUNFENG, CHEN XUEKUI, LUO ZHINING, YIN JIANGANG, NI JUNXIN
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creator YU JUNHUA
HE QINGMING
LU JINZHOU
LIU YOUYUE
GAO YUNFENG
CHEN XUEKUI
LUO ZHINING
YIN JIANGANG
NI JUNXIN
description The utility model relates to the technical field of semiconductors, in particular to an ejector pin mechanism and semiconductor processing equipment. The ejector pin mechanism comprises a first supporting structure, a top cap assembly and an ejector pin assembly, the product is suitable for being placed on the top cap assembly, a thin film material is attached to the surface of the product, and the top cap assembly is suitable for adsorbing the thin film material; the top cap assembly is suitable for driving the film material to move in the direction away from the product so as to achieve separation of the product and the film material. A product is placed on the top cap assembly, the external adsorption mechanism moves towards the product to adsorb the product, meanwhile, the ejector pin assembly ejects out to fix the product, the top cap assembly sucks a thin film material, the thin film material moves in the direction away from the product, and demolding of the product is achieved. And in the demolding pro
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Ejector pin mechanism and semiconductor processing equipment
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