Chip structure capable of preventing chip structure from warping

The utility model discloses a chip structure capable of preventing the chip structure from warping, which comprises a packaging shell I and a packaging shell II, a chip seat is arranged in the packaging shell I, a gasket is arranged on the surface of the chip seat, a chip is arranged on the surface of the gasket, three pins are arranged on one side of the chip seat, and the pins are arranged on the other side of the chip seat. First mounting boxes are fixedly connected to the two sides of the first packaging shell, second mounting boxes are fixedly connected to the two sides of the second packaging shell, movable rods are arranged in the first mounting boxes, one sides of the movable rods penetrate through the first mounting boxes and are fixedly connected with pressing blocks, and first fixing rods are fixedly connected to the tops of the movable rods; the chip packaging structure has the beneficial effects that the gasket is made of a copper-molybdenum alloy material, and the thermal expansion coefficient o