Wafer appearance detection device

Wafer appearance detection device

The utility model relates to the technical field of wafer production, in particular to a wafer appearance detection device which comprises a bottom plate, an appearance detection station, a visual detection mechanism and an XY linear module are arranged on the bottom plate, the appearance detection...

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Hauptverfasser: YE SHENGNONG, LI LINWEN, ZENG ZHIDONG, LIN CHANGDA, GUO HAIBING
Format: Patent
Sprache:chi ; eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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creator YE SHENGNONG
LI LINWEN
ZENG ZHIDONG
LIN CHANGDA
GUO HAIBING
description The utility model relates to the technical field of wafer production, in particular to a wafer appearance detection device which comprises a bottom plate, an appearance detection station, a visual detection mechanism and an XY linear module are arranged on the bottom plate, the appearance detection station is arranged on one side of the XY linear module, and the visual detection mechanism is installed on the XY linear module; the appearance detection station comprises a substrate, a wafer positioning jig, a rotary driving mechanism and an edge searching and deviation rectifying mechanism; the rotation driving mechanism and the edge searching and deviation rectifying mechanism are both arranged on the substrate, the wafer positioning jig is rotatably installed on the substrate, and the wafer positioning jig is connected with the rotation driving mechanism. According to the utility model, the edge-searching and deviation-rectifying mechanism is arranged on the substrate, the wafer positioning jig is driven to r
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218445079UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218445079UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218445079UU3</originalsourceid><addsrcrecordid>eNrjZFAMT0xLLVJILChITSxKzEtOVUhJLUlNLsnMzwOyyjKTU3kYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhhYmJqYG5ZWioMVGKANH4JoA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer appearance detection device</title><source>esp@cenet</source><creator>YE SHENGNONG ; LI LINWEN ; ZENG ZHIDONG ; LIN CHANGDA ; GUO HAIBING</creator><creatorcontrib>YE SHENGNONG ; LI LINWEN ; ZENG ZHIDONG ; LIN CHANGDA ; GUO HAIBING</creatorcontrib><description>The utility model relates to the technical field of wafer production, in particular to a wafer appearance detection device which comprises a bottom plate, an appearance detection station, a visual detection mechanism and an XY linear module are arranged on the bottom plate, the appearance detection station is arranged on one side of the XY linear module, and the visual detection mechanism is installed on the XY linear module; the appearance detection station comprises a substrate, a wafer positioning jig, a rotary driving mechanism and an edge searching and deviation rectifying mechanism; the rotation driving mechanism and the edge searching and deviation rectifying mechanism are both arranged on the substrate, the wafer positioning jig is rotatably installed on the substrate, and the wafer positioning jig is connected with the rotation driving mechanism. According to the utility model, the edge-searching and deviation-rectifying mechanism is arranged on the substrate, the wafer positioning jig is driven to r</description><language>chi ; eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230203&amp;DB=EPODOC&amp;CC=CN&amp;NR=218445079U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230203&amp;DB=EPODOC&amp;CC=CN&amp;NR=218445079U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YE SHENGNONG</creatorcontrib><creatorcontrib>LI LINWEN</creatorcontrib><creatorcontrib>ZENG ZHIDONG</creatorcontrib><creatorcontrib>LIN CHANGDA</creatorcontrib><creatorcontrib>GUO HAIBING</creatorcontrib><title>Wafer appearance detection device</title><description>The utility model relates to the technical field of wafer production, in particular to a wafer appearance detection device which comprises a bottom plate, an appearance detection station, a visual detection mechanism and an XY linear module are arranged on the bottom plate, the appearance detection station is arranged on one side of the XY linear module, and the visual detection mechanism is installed on the XY linear module; the appearance detection station comprises a substrate, a wafer positioning jig, a rotary driving mechanism and an edge searching and deviation rectifying mechanism; the rotation driving mechanism and the edge searching and deviation rectifying mechanism are both arranged on the substrate, the wafer positioning jig is rotatably installed on the substrate, and the wafer positioning jig is connected with the rotation driving mechanism. According to the utility model, the edge-searching and deviation-rectifying mechanism is arranged on the substrate, the wafer positioning jig is driven to r</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAMT0xLLVJILChITSxKzEtOVUhJLUlNLsnMzwOyyjKTU3kYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn5GhhYmJqYG5ZWioMVGKANH4JoA</recordid><startdate>20230203</startdate><enddate>20230203</enddate><creator>YE SHENGNONG</creator><creator>LI LINWEN</creator><creator>ZENG ZHIDONG</creator><creator>LIN CHANGDA</creator><creator>GUO HAIBING</creator><scope>EVB</scope></search><sort><creationdate>20230203</creationdate><title>Wafer appearance detection device</title><author>YE SHENGNONG ; LI LINWEN ; ZENG ZHIDONG ; LIN CHANGDA ; GUO HAIBING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218445079UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YE SHENGNONG</creatorcontrib><creatorcontrib>LI LINWEN</creatorcontrib><creatorcontrib>ZENG ZHIDONG</creatorcontrib><creatorcontrib>LIN CHANGDA</creatorcontrib><creatorcontrib>GUO HAIBING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YE SHENGNONG</au><au>LI LINWEN</au><au>ZENG ZHIDONG</au><au>LIN CHANGDA</au><au>GUO HAIBING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer appearance detection device</title><date>2023-02-03</date><risdate>2023</risdate><abstract>The utility model relates to the technical field of wafer production, in particular to a wafer appearance detection device which comprises a bottom plate, an appearance detection station, a visual detection mechanism and an XY linear module are arranged on the bottom plate, the appearance detection station is arranged on one side of the XY linear module, and the visual detection mechanism is installed on the XY linear module; the appearance detection station comprises a substrate, a wafer positioning jig, a rotary driving mechanism and an edge searching and deviation rectifying mechanism; the rotation driving mechanism and the edge searching and deviation rectifying mechanism are both arranged on the substrate, the wafer positioning jig is rotatably installed on the substrate, and the wafer positioning jig is connected with the rotation driving mechanism. According to the utility model, the edge-searching and deviation-rectifying mechanism is arranged on the substrate, the wafer positioning jig is driven to r</abstract><oa>free_for_read</oa></addata></record>
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subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Wafer appearance detection device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T18%3A06%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YE%20SHENGNONG&rft.date=2023-02-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218445079UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true