Wire-drawing die polishing device

The utility model discloses a polishing device for a wire-drawing die. The polishing device comprises a base, the fixing mechanism is arranged on the base; the driving mechanism is in transmission connection with the fixing mechanism; the line polishing mechanism comprises a connecting rod, a polish...

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Hauptverfasser: GE QIANG, GUO NAIZHU, HUANG KEJUN, LI WANCHUN, SU YANPING
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Sprache:chi ; eng
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creator GE QIANG
GUO NAIZHU
HUANG KEJUN
LI WANCHUN
SU YANPING
description The utility model discloses a polishing device for a wire-drawing die. The polishing device comprises a base, the fixing mechanism is arranged on the base; the driving mechanism is in transmission connection with the fixing mechanism; the line polishing mechanism comprises a connecting rod, a polishing line, a first line polishing assembly and a second line polishing assembly, one end of the polishing line is connected with the first line polishing assembly, the other end of the polishing line is connected with the second line polishing assembly, one end of the connecting rod is slidably connected with the first line polishing assembly, the other end of the connecting rod is connected with the second line polishing assembly, and the driving mechanism is in transmission connection with the connecting rod; and the detection mechanism comprises a first pressure sensor, one side of the first pressure sensor is fixed to the connecting rod, the other side of the first pressure sensor is used for abutting against th
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218427617UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218427617UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218427617UU3</originalsourceid><addsrcrecordid>eNrjZFAMzyxK1U0pSizPzEtXSMlMVSjIz8kszgDzUssyk1N5GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RoYWJkbmZoXloqDFRigDJTiZn</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wire-drawing die polishing device</title><source>esp@cenet</source><creator>GE QIANG ; GUO NAIZHU ; HUANG KEJUN ; LI WANCHUN ; SU YANPING</creator><creatorcontrib>GE QIANG ; GUO NAIZHU ; HUANG KEJUN ; LI WANCHUN ; SU YANPING</creatorcontrib><description>The utility model discloses a polishing device for a wire-drawing die. The polishing device comprises a base, the fixing mechanism is arranged on the base; the driving mechanism is in transmission connection with the fixing mechanism; the line polishing mechanism comprises a connecting rod, a polishing line, a first line polishing assembly and a second line polishing assembly, one end of the polishing line is connected with the first line polishing assembly, the other end of the polishing line is connected with the second line polishing assembly, one end of the connecting rod is slidably connected with the first line polishing assembly, the other end of the connecting rod is connected with the second line polishing assembly, and the driving mechanism is in transmission connection with the connecting rod; and the detection mechanism comprises a first pressure sensor, one side of the first pressure sensor is fixed to the connecting rod, the other side of the first pressure sensor is used for abutting against th</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230203&amp;DB=EPODOC&amp;CC=CN&amp;NR=218427617U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230203&amp;DB=EPODOC&amp;CC=CN&amp;NR=218427617U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GE QIANG</creatorcontrib><creatorcontrib>GUO NAIZHU</creatorcontrib><creatorcontrib>HUANG KEJUN</creatorcontrib><creatorcontrib>LI WANCHUN</creatorcontrib><creatorcontrib>SU YANPING</creatorcontrib><title>Wire-drawing die polishing device</title><description>The utility model discloses a polishing device for a wire-drawing die. The polishing device comprises a base, the fixing mechanism is arranged on the base; the driving mechanism is in transmission connection with the fixing mechanism; the line polishing mechanism comprises a connecting rod, a polishing line, a first line polishing assembly and a second line polishing assembly, one end of the polishing line is connected with the first line polishing assembly, the other end of the polishing line is connected with the second line polishing assembly, one end of the connecting rod is slidably connected with the first line polishing assembly, the other end of the connecting rod is connected with the second line polishing assembly, and the driving mechanism is in transmission connection with the connecting rod; and the detection mechanism comprises a first pressure sensor, one side of the first pressure sensor is fixed to the connecting rod, the other side of the first pressure sensor is used for abutting against th</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAMzyxK1U0pSizPzEtXSMlMVSjIz8kszgDzUssyk1N5GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RoYWJkbmZoXloqDFRigDJTiZn</recordid><startdate>20230203</startdate><enddate>20230203</enddate><creator>GE QIANG</creator><creator>GUO NAIZHU</creator><creator>HUANG KEJUN</creator><creator>LI WANCHUN</creator><creator>SU YANPING</creator><scope>EVB</scope></search><sort><creationdate>20230203</creationdate><title>Wire-drawing die polishing device</title><author>GE QIANG ; GUO NAIZHU ; HUANG KEJUN ; LI WANCHUN ; SU YANPING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218427617UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GE QIANG</creatorcontrib><creatorcontrib>GUO NAIZHU</creatorcontrib><creatorcontrib>HUANG KEJUN</creatorcontrib><creatorcontrib>LI WANCHUN</creatorcontrib><creatorcontrib>SU YANPING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GE QIANG</au><au>GUO NAIZHU</au><au>HUANG KEJUN</au><au>LI WANCHUN</au><au>SU YANPING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wire-drawing die polishing device</title><date>2023-02-03</date><risdate>2023</risdate><abstract>The utility model discloses a polishing device for a wire-drawing die. The polishing device comprises a base, the fixing mechanism is arranged on the base; the driving mechanism is in transmission connection with the fixing mechanism; the line polishing mechanism comprises a connecting rod, a polishing line, a first line polishing assembly and a second line polishing assembly, one end of the polishing line is connected with the first line polishing assembly, the other end of the polishing line is connected with the second line polishing assembly, one end of the connecting rod is slidably connected with the first line polishing assembly, the other end of the connecting rod is connected with the second line polishing assembly, and the driving mechanism is in transmission connection with the connecting rod; and the detection mechanism comprises a first pressure sensor, one side of the first pressure sensor is fixed to the connecting rod, the other side of the first pressure sensor is used for abutting against th</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title Wire-drawing die polishing device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T11%3A28%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GE%20QIANG&rft.date=2023-02-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218427617UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true