Semiconductor material centering bilateral clamping mechanism
The utility model relates to a semiconductor material centering bilateral clamping mechanism, which comprises a first bilateral clamping mechanism, a dust sticking unit, a second bilateral clamping mechanism and a film pressing unit which are sequentially arranged, the first bilateral clamping mecha...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a semiconductor material centering bilateral clamping mechanism, which comprises a first bilateral clamping mechanism, a dust sticking unit, a second bilateral clamping mechanism and a film pressing unit which are sequentially arranged, the first bilateral clamping mechanism comprises a first connection roller, a left machine plate arranged on one side of the first connection roller, and a right machine plate arranged on the other side of the first connection roller; a first guide rod is arranged between the right machine plate and the left machine plate, a left sliding block is arranged on one side of the first guide rod, a right sliding block is arranged on the other side of the first guide rod, first guide wheels are arranged on the top of the right sliding block and the top of the left sliding block, and the first guide wheels are located on the two sides of the first connection rolling wheel. The first double-side clamping mechanism and the second double-side clamping mechani |
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