Grinding device for high-pressure bypass valve
The utility model relates to a grinder for a high bypass valve. The grinder comprises a grinding unit and a concentricity adjusting unit, a grinding part is arranged at the bottom of the grinding unit; the grinding part can extend into the valve seat of the high-pressure bypass valve and grind the i...
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| creator | GUO JINWEN LEE DUCK-HO WANG YANFANG JIANG BIN JIANG MIAORONG YU HUAWEN LIU BOYANG ZHENG WEIDONG MAO QIHUAI CI XUEMIN LI PEIYU YANG QIKUN NIU YONGZHE FANG WEIGUO MAO GUOMING ZHANG SHOUWEN LI LEI |
| description | The utility model relates to a grinder for a high bypass valve. The grinder comprises a grinding unit and a concentricity adjusting unit, a grinding part is arranged at the bottom of the grinding unit; the grinding part can extend into the valve seat of the high-pressure bypass valve and grind the inner wall of the valve seat, so that the maintenance difficulty and the maintenance cost of the valve seat are effectively reduced. The concentricity adjusting unit is suitable for being installed at the top end of the valve seat, a limiting hole is formed in the middle, the upper portion of the grinding unit is sleeved with the concentricity adjusting unit through the limiting hole, and the axis of the grinding unit and the axis of the valve seat can be located on the same straight line. Compared with a traditional grinder for the high bypass valve, the grinder for the high bypass valve is additionally provided with the concentricity adjusting unit, the concentricity adjusting unit enables the axis of the grinding |
| format | Patent |
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The grinder comprises a grinding unit and a concentricity adjusting unit, a grinding part is arranged at the bottom of the grinding unit; the grinding part can extend into the valve seat of the high-pressure bypass valve and grind the inner wall of the valve seat, so that the maintenance difficulty and the maintenance cost of the valve seat are effectively reduced. The concentricity adjusting unit is suitable for being installed at the top end of the valve seat, a limiting hole is formed in the middle, the upper portion of the grinding unit is sleeved with the concentricity adjusting unit through the limiting hole, and the axis of the grinding unit and the axis of the valve seat can be located on the same straight line. Compared with a traditional grinder for the high bypass valve, the grinder for the high bypass valve is additionally provided with the concentricity adjusting unit, the concentricity adjusting unit enables the axis of the grinding</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230113&DB=EPODOC&CC=CN&NR=218284974U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230113&DB=EPODOC&CC=CN&NR=218284974U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUO JINWEN</creatorcontrib><creatorcontrib>LEE DUCK-HO</creatorcontrib><creatorcontrib>WANG YANFANG</creatorcontrib><creatorcontrib>JIANG BIN</creatorcontrib><creatorcontrib>JIANG MIAORONG</creatorcontrib><creatorcontrib>YU HUAWEN</creatorcontrib><creatorcontrib>LIU BOYANG</creatorcontrib><creatorcontrib>ZHENG WEIDONG</creatorcontrib><creatorcontrib>MAO QIHUAI</creatorcontrib><creatorcontrib>CI XUEMIN</creatorcontrib><creatorcontrib>LI PEIYU</creatorcontrib><creatorcontrib>YANG QIKUN</creatorcontrib><creatorcontrib>NIU YONGZHE</creatorcontrib><creatorcontrib>FANG WEIGUO</creatorcontrib><creatorcontrib>MAO GUOMING</creatorcontrib><creatorcontrib>ZHANG SHOUWEN</creatorcontrib><creatorcontrib>LI LEI</creatorcontrib><title>Grinding device for high-pressure bypass valve</title><description>The utility model relates to a grinder for a high bypass valve. The grinder comprises a grinding unit and a concentricity adjusting unit, a grinding part is arranged at the bottom of the grinding unit; the grinding part can extend into the valve seat of the high-pressure bypass valve and grind the inner wall of the valve seat, so that the maintenance difficulty and the maintenance cost of the valve seat are effectively reduced. The concentricity adjusting unit is suitable for being installed at the top end of the valve seat, a limiting hole is formed in the middle, the upper portion of the grinding unit is sleeved with the concentricity adjusting unit through the limiting hole, and the axis of the grinding unit and the axis of the valve seat can be located on the same straight line. Compared with a traditional grinder for the high bypass valve, the grinder for the high bypass valve is additionally provided with the concentricity adjusting unit, the concentricity adjusting unit enables the axis of the grinding</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzL8rMS8nMS1dISS3LTE5VSMsvUsjITM_QLShKLS4uLUpVSKosSCwuVihLzClL5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoYWRhYmluYmoaHGRCkCAFlcK4I</recordid><startdate>20230113</startdate><enddate>20230113</enddate><creator>GUO JINWEN</creator><creator>LEE DUCK-HO</creator><creator>WANG YANFANG</creator><creator>JIANG BIN</creator><creator>JIANG MIAORONG</creator><creator>YU HUAWEN</creator><creator>LIU BOYANG</creator><creator>ZHENG WEIDONG</creator><creator>MAO QIHUAI</creator><creator>CI XUEMIN</creator><creator>LI PEIYU</creator><creator>YANG QIKUN</creator><creator>NIU YONGZHE</creator><creator>FANG WEIGUO</creator><creator>MAO GUOMING</creator><creator>ZHANG SHOUWEN</creator><creator>LI LEI</creator><scope>EVB</scope></search><sort><creationdate>20230113</creationdate><title>Grinding device for high-pressure bypass valve</title><author>GUO JINWEN ; LEE DUCK-HO ; WANG YANFANG ; JIANG BIN ; JIANG MIAORONG ; YU HUAWEN ; LIU BOYANG ; ZHENG WEIDONG ; MAO QIHUAI ; CI XUEMIN ; LI PEIYU ; YANG QIKUN ; NIU YONGZHE ; FANG WEIGUO ; MAO GUOMING ; ZHANG SHOUWEN ; LI LEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218284974UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GUO JINWEN</creatorcontrib><creatorcontrib>LEE DUCK-HO</creatorcontrib><creatorcontrib>WANG YANFANG</creatorcontrib><creatorcontrib>JIANG BIN</creatorcontrib><creatorcontrib>JIANG MIAORONG</creatorcontrib><creatorcontrib>YU HUAWEN</creatorcontrib><creatorcontrib>LIU BOYANG</creatorcontrib><creatorcontrib>ZHENG WEIDONG</creatorcontrib><creatorcontrib>MAO QIHUAI</creatorcontrib><creatorcontrib>CI XUEMIN</creatorcontrib><creatorcontrib>LI PEIYU</creatorcontrib><creatorcontrib>YANG QIKUN</creatorcontrib><creatorcontrib>NIU YONGZHE</creatorcontrib><creatorcontrib>FANG WEIGUO</creatorcontrib><creatorcontrib>MAO GUOMING</creatorcontrib><creatorcontrib>ZHANG SHOUWEN</creatorcontrib><creatorcontrib>LI LEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUO JINWEN</au><au>LEE DUCK-HO</au><au>WANG YANFANG</au><au>JIANG BIN</au><au>JIANG MIAORONG</au><au>YU HUAWEN</au><au>LIU BOYANG</au><au>ZHENG WEIDONG</au><au>MAO QIHUAI</au><au>CI XUEMIN</au><au>LI PEIYU</au><au>YANG QIKUN</au><au>NIU YONGZHE</au><au>FANG WEIGUO</au><au>MAO GUOMING</au><au>ZHANG SHOUWEN</au><au>LI LEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding device for high-pressure bypass valve</title><date>2023-01-13</date><risdate>2023</risdate><abstract>The utility model relates to a grinder for a high bypass valve. The grinder comprises a grinding unit and a concentricity adjusting unit, a grinding part is arranged at the bottom of the grinding unit; the grinding part can extend into the valve seat of the high-pressure bypass valve and grind the inner wall of the valve seat, so that the maintenance difficulty and the maintenance cost of the valve seat are effectively reduced. The concentricity adjusting unit is suitable for being installed at the top end of the valve seat, a limiting hole is formed in the middle, the upper portion of the grinding unit is sleeved with the concentricity adjusting unit through the limiting hole, and the axis of the grinding unit and the axis of the valve seat can be located on the same straight line. Compared with a traditional grinder for the high bypass valve, the grinder for the high bypass valve is additionally provided with the concentricity adjusting unit, the concentricity adjusting unit enables the axis of the grinding</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Grinding device for high-pressure bypass valve |
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