Die bonder for electronic product processing
The utility model relates to the technical field of electronic product processing equipment, in particular to a die bonder for electronic product processing, which comprises a working table, a rack is arranged on the working table, a placing table for placing a PCB (printed circuit board) is fixedly...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ZHAO LIWU |
| description | The utility model relates to the technical field of electronic product processing equipment, in particular to a die bonder for electronic product processing, which comprises a working table, a rack is arranged on the working table, a placing table for placing a PCB (printed circuit board) is fixedly arranged at the upper surface end of the working table, clamping devices for clamping the PCB are symmetrically arranged on two sides of the placing table, and the clamping devices are used for clamping the PCB. The right side of the upper surface of the workbench is provided with an object placing table used for placing wafers, a dispensing device is arranged above the object placing table, a wafer suction device is arranged above the object placing table, the dispensing device and the wafer suction device are connected with a moving device arranged on the upper portion of the rack, and a glue storage box used for storing glue liquid is arranged outside the rack. The device has a good PCB fixing effect, is suitab |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218277713UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218277713UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218277713UU3</originalsourceid><addsrcrecordid>eNrjZNBxyUxVSMrPS0ktUkjLL1JIzUlNLinKz8tMVigoyk8pTS4B0cmpxcWZeek8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_I0MLI3Nzc0Dg01JgoRQD0virM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Die bonder for electronic product processing</title><source>esp@cenet</source><creator>ZHAO LIWU</creator><creatorcontrib>ZHAO LIWU</creatorcontrib><description>The utility model relates to the technical field of electronic product processing equipment, in particular to a die bonder for electronic product processing, which comprises a working table, a rack is arranged on the working table, a placing table for placing a PCB (printed circuit board) is fixedly arranged at the upper surface end of the working table, clamping devices for clamping the PCB are symmetrically arranged on two sides of the placing table, and the clamping devices are used for clamping the PCB. The right side of the upper surface of the workbench is provided with an object placing table used for placing wafers, a dispensing device is arranged above the object placing table, a wafer suction device is arranged above the object placing table, the dispensing device and the wafer suction device are connected with a moving device arranged on the upper portion of the rack, and a glue storage box used for storing glue liquid is arranged outside the rack. The device has a good PCB fixing effect, is suitab</description><language>chi ; eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230110&DB=EPODOC&CC=CN&NR=218277713U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230110&DB=EPODOC&CC=CN&NR=218277713U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO LIWU</creatorcontrib><title>Die bonder for electronic product processing</title><description>The utility model relates to the technical field of electronic product processing equipment, in particular to a die bonder for electronic product processing, which comprises a working table, a rack is arranged on the working table, a placing table for placing a PCB (printed circuit board) is fixedly arranged at the upper surface end of the working table, clamping devices for clamping the PCB are symmetrically arranged on two sides of the placing table, and the clamping devices are used for clamping the PCB. The right side of the upper surface of the workbench is provided with an object placing table used for placing wafers, a dispensing device is arranged above the object placing table, a wafer suction device is arranged above the object placing table, the dispensing device and the wafer suction device are connected with a moving device arranged on the upper portion of the rack, and a glue storage box used for storing glue liquid is arranged outside the rack. The device has a good PCB fixing effect, is suitab</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBxyUxVSMrPS0ktUkjLL1JIzUlNLinKz8tMVigoyk8pTS4B0cmpxcWZeek8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_I0MLI3Nzc0Dg01JgoRQD0virM</recordid><startdate>20230110</startdate><enddate>20230110</enddate><creator>ZHAO LIWU</creator><scope>EVB</scope></search><sort><creationdate>20230110</creationdate><title>Die bonder for electronic product processing</title><author>ZHAO LIWU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218277713UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHAO LIWU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHAO LIWU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Die bonder for electronic product processing</title><date>2023-01-10</date><risdate>2023</risdate><abstract>The utility model relates to the technical field of electronic product processing equipment, in particular to a die bonder for electronic product processing, which comprises a working table, a rack is arranged on the working table, a placing table for placing a PCB (printed circuit board) is fixedly arranged at the upper surface end of the working table, clamping devices for clamping the PCB are symmetrically arranged on two sides of the placing table, and the clamping devices are used for clamping the PCB. The right side of the upper surface of the workbench is provided with an object placing table used for placing wafers, a dispensing device is arranged above the object placing table, a wafer suction device is arranged above the object placing table, the dispensing device and the wafer suction device are connected with a moving device arranged on the upper portion of the rack, and a glue storage box used for storing glue liquid is arranged outside the rack. The device has a good PCB fixing effect, is suitab</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN218277713UU |
| source | esp@cenet |
| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | Die bonder for electronic product processing |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T10%3A44%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHAO%20LIWU&rft.date=2023-01-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218277713UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |