Composite heat-conducting silica gel gasket
The utility model provides a composite heat-conducting silica gel gasket which comprises a gasket body, a frame is arranged on the periphery of the gasket body, the gasket body comprises a first silica gel layer, a first metal foil heat-conducting layer is bonded below the first silica gel layer, a...
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| creator | WU FUDONG WU KANGSHENG |
| description | The utility model provides a composite heat-conducting silica gel gasket which comprises a gasket body, a frame is arranged on the periphery of the gasket body, the gasket body comprises a first silica gel layer, a first metal foil heat-conducting layer is bonded below the first silica gel layer, a middle heat-conducting layer is bonded below the first metal foil heat-conducting layer, and a second silica gel layer is bonded below the middle heat-conducting layer. A second metal foil heat conduction layer is bonded below the middle heat conduction layer, and a second silica gel layer is bonded below the second metal foil heat conduction layer; by arranging the frame, the wrapping performance of the gasket on the electronic component can be improved, by arranging the first metal foil heat conduction layer, the middle heat conduction layer and the second metal foil heat conduction layer, heat generated by the electronic component can be rapidly transmitted out, and the use performance and stability of the elect |
| format | Patent |
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A second metal foil heat conduction layer is bonded below the middle heat conduction layer, and a second silica gel layer is bonded below the second metal foil heat conduction layer; by arranging the frame, the wrapping performance of the gasket on the electronic component can be improved, by arranging the first metal foil heat conduction layer, the middle heat conduction layer and the second metal foil heat conduction layer, heat generated by the electronic component can be rapidly transmitted out, and the use performance and stability of the elect</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230110&DB=EPODOC&CC=CN&NR=218277594U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230110&DB=EPODOC&CC=CN&NR=218277594U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU FUDONG</creatorcontrib><creatorcontrib>WU KANGSHENG</creatorcontrib><title>Composite heat-conducting silica gel gasket</title><description>The utility model provides a composite heat-conducting silica gel gasket which comprises a gasket body, a frame is arranged on the periphery of the gasket body, the gasket body comprises a first silica gel layer, a first metal foil heat-conducting layer is bonded below the first silica gel layer, a middle heat-conducting layer is bonded below the first metal foil heat-conducting layer, and a second silica gel layer is bonded below the middle heat-conducting layer. 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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Composite heat-conducting silica gel gasket |
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