Anti-warping high-performance ceramic substrate

Anti-warping high-performance ceramic substrate

The utility model discloses an anti-warping high-performance ceramic substrate, which relates to the technical field of ceramic substrates and comprises a substrate main body and a protection box arranged on the outer side wall of the substrate main body, and a heat dissipation mechanism is arranged...

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Hauptverfasser: DING YANQI, NIU RUIBO, ZHANG TIANYU
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Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator DING YANQI
NIU RUIBO
ZHANG TIANYU
description The utility model discloses an anti-warping high-performance ceramic substrate, which relates to the technical field of ceramic substrates and comprises a substrate main body and a protection box arranged on the outer side wall of the substrate main body, and a heat dissipation mechanism is arranged in the protection box. The heat dissipation mechanism comprises a movable groove formed in a bottom plate in the protection box, a connecting spring fixedly connected to the groove bottom of the movable groove, a heat conduction silica gel sheet fixedly connected to the other end of the connecting spring, heat dissipation holes formed in the outer side wall of the protection box, through holes formed in the outer side wall of the heat conduction silica gel sheet, and a dustproof net fixedly connected to the outer side wall of the protection box. According to the anti-warping high-performance ceramic substrate provided by the utility model, the heat-conducting silica gel sheet abuts against the substrate main body
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Anti-warping high-performance ceramic substrate
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