Copper-based circuit board transfer tool
The utility model provides a copper-based circuit board transfer tool which comprises an epoxy resin plate, a plurality of rectangular placing grooves arranged in an array are formed in the epoxy resin plate, a plurality of supporting plates are arranged on the edges of the inner walls of the rectan...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ZHU GUANGHUI YU WEIHANG CHEN RONGXIAN LIANG SHAOYI CHEN QITAO CHENG YOUHE |
| description | The utility model provides a copper-based circuit board transfer tool which comprises an epoxy resin plate, a plurality of rectangular placing grooves arranged in an array are formed in the epoxy resin plate, a plurality of supporting plates are arranged on the edges of the inner walls of the rectangular placing grooves in a protruding mode towards the inner sides of the rectangular placing grooves, and the bottom faces of the supporting plates are flush with the bottom face of the epoxy resin plate. The thickness of the supporting plate is smaller than that of the epoxy resin plate, a placing space for placing the copper-based circuit board is formed above the supporting plate, and the supporting plate is arranged corresponding to a high-frequency material part of the copper-based circuit board. According to the utility model, the problems of pits or collision damage, board falling and the like caused by the fact that a high-frequency material part on the circuit board is pressed in the operation process of |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN218056573UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN218056573UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN218056573UU3</originalsourceid><addsrcrecordid>eNrjZNBwzi8oSC3STUosTk1RSM4sSi7NLFFIyk8sSlEoKUrMK05LLVIoyc_P4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoYWBqZmpubGoaHGRCkCACJ7KSA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Copper-based circuit board transfer tool</title><source>esp@cenet</source><creator>ZHU GUANGHUI ; YU WEIHANG ; CHEN RONGXIAN ; LIANG SHAOYI ; CHEN QITAO ; CHENG YOUHE</creator><creatorcontrib>ZHU GUANGHUI ; YU WEIHANG ; CHEN RONGXIAN ; LIANG SHAOYI ; CHEN QITAO ; CHENG YOUHE</creatorcontrib><description>The utility model provides a copper-based circuit board transfer tool which comprises an epoxy resin plate, a plurality of rectangular placing grooves arranged in an array are formed in the epoxy resin plate, a plurality of supporting plates are arranged on the edges of the inner walls of the rectangular placing grooves in a protruding mode towards the inner sides of the rectangular placing grooves, and the bottom faces of the supporting plates are flush with the bottom face of the epoxy resin plate. The thickness of the supporting plate is smaller than that of the epoxy resin plate, a placing space for placing the copper-based circuit board is formed above the supporting plate, and the supporting plate is arranged corresponding to a high-frequency material part of the copper-based circuit board. According to the utility model, the problems of pits or collision damage, board falling and the like caused by the fact that a high-frequency material part on the circuit board is pressed in the operation process of</description><language>chi ; eng</language><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS ; CONVEYING ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKAGES ; PACKAGING ELEMENTS ; PACKING ; PERFORMING OPERATIONS ; STORING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221216&DB=EPODOC&CC=CN&NR=218056573U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221216&DB=EPODOC&CC=CN&NR=218056573U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHU GUANGHUI</creatorcontrib><creatorcontrib>YU WEIHANG</creatorcontrib><creatorcontrib>CHEN RONGXIAN</creatorcontrib><creatorcontrib>LIANG SHAOYI</creatorcontrib><creatorcontrib>CHEN QITAO</creatorcontrib><creatorcontrib>CHENG YOUHE</creatorcontrib><title>Copper-based circuit board transfer tool</title><description>The utility model provides a copper-based circuit board transfer tool which comprises an epoxy resin plate, a plurality of rectangular placing grooves arranged in an array are formed in the epoxy resin plate, a plurality of supporting plates are arranged on the edges of the inner walls of the rectangular placing grooves in a protruding mode towards the inner sides of the rectangular placing grooves, and the bottom faces of the supporting plates are flush with the bottom face of the epoxy resin plate. The thickness of the supporting plate is smaller than that of the epoxy resin plate, a placing space for placing the copper-based circuit board is formed above the supporting plate, and the supporting plate is arranged corresponding to a high-frequency material part of the copper-based circuit board. According to the utility model, the problems of pits or collision damage, board falling and the like caused by the fact that a high-frequency material part on the circuit board is pressed in the operation process of</description><subject>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</subject><subject>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</subject><subject>CONVEYING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>PACKAGES</subject><subject>PACKAGING ELEMENTS</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>STORING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBwzi8oSC3STUosTk1RSM4sSi7NLFFIyk8sSlEoKUrMK05LLVIoyc_P4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoYWBqZmpubGoaHGRCkCACJ7KSA</recordid><startdate>20221216</startdate><enddate>20221216</enddate><creator>ZHU GUANGHUI</creator><creator>YU WEIHANG</creator><creator>CHEN RONGXIAN</creator><creator>LIANG SHAOYI</creator><creator>CHEN QITAO</creator><creator>CHENG YOUHE</creator><scope>EVB</scope></search><sort><creationdate>20221216</creationdate><title>Copper-based circuit board transfer tool</title><author>ZHU GUANGHUI ; YU WEIHANG ; CHEN RONGXIAN ; LIANG SHAOYI ; CHEN QITAO ; CHENG YOUHE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN218056573UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR</topic><topic>CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS</topic><topic>CONVEYING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>PACKAGES</topic><topic>PACKAGING ELEMENTS</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>STORING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHU GUANGHUI</creatorcontrib><creatorcontrib>YU WEIHANG</creatorcontrib><creatorcontrib>CHEN RONGXIAN</creatorcontrib><creatorcontrib>LIANG SHAOYI</creatorcontrib><creatorcontrib>CHEN QITAO</creatorcontrib><creatorcontrib>CHENG YOUHE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHU GUANGHUI</au><au>YU WEIHANG</au><au>CHEN RONGXIAN</au><au>LIANG SHAOYI</au><au>CHEN QITAO</au><au>CHENG YOUHE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Copper-based circuit board transfer tool</title><date>2022-12-16</date><risdate>2022</risdate><abstract>The utility model provides a copper-based circuit board transfer tool which comprises an epoxy resin plate, a plurality of rectangular placing grooves arranged in an array are formed in the epoxy resin plate, a plurality of supporting plates are arranged on the edges of the inner walls of the rectangular placing grooves in a protruding mode towards the inner sides of the rectangular placing grooves, and the bottom faces of the supporting plates are flush with the bottom face of the epoxy resin plate. The thickness of the supporting plate is smaller than that of the epoxy resin plate, a placing space for placing the copper-based circuit board is formed above the supporting plate, and the supporting plate is arranged corresponding to a high-frequency material part of the copper-based circuit board. According to the utility model, the problems of pits or collision damage, board falling and the like caused by the fact that a high-frequency material part on the circuit board is pressed in the operation process of</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN218056573UU |
| source | esp@cenet |
| subjects | ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING |
| title | Copper-based circuit board transfer tool |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T22%3A35%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHU%20GUANGHUI&rft.date=2022-12-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN218056573UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |