Suction nozzle for sucking chips and chip sucking device
The utility model discloses a suction nozzle for sucking a chip and a chip sucking device, relates to the technical field of semiconductor packaging, and aims to solve the problem that a sensitive area is easily pressed and damaged when the chip is sucked. The suction nozzle used for sucking the chi...
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| creator | CHANG GUILIAN LIU CHANGHUA |
| description | The utility model discloses a suction nozzle for sucking a chip and a chip sucking device, relates to the technical field of semiconductor packaging, and aims to solve the problem that a sensitive area is easily pressed and damaged when the chip is sucked. The suction nozzle used for sucking the chip comprises a suction nozzle body, the suction nozzle body is internally provided with a gas channel used for sucking the chip, the suction end of the suction nozzle body is provided with a receding groove formed by sinking inwards and a vent hole communicating the interior of the receding groove with the exterior of the suction nozzle body, and the chip comprises a sensitive area and a non-sensitive area; when the chip is sucked, the clearance groove at least covers the sensitive area of the chip, the gas channel is used for sucking the non-sensitive area of the chip, and the chip sucking device comprises the suction nozzle used for sucking the chip.
本实用新型公开一种用于吸取芯片的吸嘴和芯片吸取装置，涉及半导体封装技术领域，以解决芯片吸取时敏感区域容易受压破坏的问题。所述用于 |
| format | Patent |
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本实用新型公开一种用于吸取芯片的吸嘴和芯片吸取装置，涉及半导体封装技术领域，以解决芯片吸取时敏感区域容易受压破坏的问题。所述用于</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221111&DB=EPODOC&CC=CN&NR=217788371U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221111&DB=EPODOC&CC=CN&NR=217788371U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHANG GUILIAN</creatorcontrib><creatorcontrib>LIU CHANGHUA</creatorcontrib><title>Suction nozzle for sucking chips and chip sucking device</title><description>The utility model discloses a suction nozzle for sucking a chip and a chip sucking device, relates to the technical field of semiconductor packaging, and aims to solve the problem that a sensitive area is easily pressed and damaged when the chip is sucked. The suction nozzle used for sucking the chip comprises a suction nozzle body, the suction nozzle body is internally provided with a gas channel used for sucking the chip, the suction end of the suction nozzle body is provided with a receding groove formed by sinking inwards and a vent hole communicating the interior of the receding groove with the exterior of the suction nozzle body, and the chip comprises a sensitive area and a non-sensitive area; when the chip is sucked, the clearance groove at least covers the sensitive area of the chip, the gas channel is used for sucking the non-sensitive area of the chip, and the chip sucking device comprises the suction nozzle used for sucking the chip.
本实用新型公开一种用于吸取芯片的吸嘴和芯片吸取装置，涉及半导体封装技术领域，以解决芯片吸取时敏感区域容易受压破坏的问题。所述用于</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAILk0uyczPU8jLr6rKSVVIyy9SKC5Nzs7MS1dIzsgsKFZIzEsBs-DCKallmcmpPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3tnPyNDc3MLC2NwwNNSYKEUAat8vHw</recordid><startdate>20221111</startdate><enddate>20221111</enddate><creator>CHANG GUILIAN</creator><creator>LIU CHANGHUA</creator><scope>EVB</scope></search><sort><creationdate>20221111</creationdate><title>Suction nozzle for sucking chips and chip sucking device</title><author>CHANG GUILIAN ; LIU CHANGHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217788371UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHANG GUILIAN</creatorcontrib><creatorcontrib>LIU CHANGHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHANG GUILIAN</au><au>LIU CHANGHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Suction nozzle for sucking chips and chip sucking device</title><date>2022-11-11</date><risdate>2022</risdate><abstract>The utility model discloses a suction nozzle for sucking a chip and a chip sucking device, relates to the technical field of semiconductor packaging, and aims to solve the problem that a sensitive area is easily pressed and damaged when the chip is sucked. The suction nozzle used for sucking the chip comprises a suction nozzle body, the suction nozzle body is internally provided with a gas channel used for sucking the chip, the suction end of the suction nozzle body is provided with a receding groove formed by sinking inwards and a vent hole communicating the interior of the receding groove with the exterior of the suction nozzle body, and the chip comprises a sensitive area and a non-sensitive area; when the chip is sucked, the clearance groove at least covers the sensitive area of the chip, the gas channel is used for sucking the non-sensitive area of the chip, and the chip sucking device comprises the suction nozzle used for sucking the chip.
本实用新型公开一种用于吸取芯片的吸嘴和芯片吸取装置，涉及半导体封装技术领域，以解决芯片吸取时敏感区域容易受压破坏的问题。所述用于</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Suction nozzle for sucking chips and chip sucking device |
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