Optical module

The utility model discloses an optical module. A hollowed-out area comprises a first hollowed-out area and a second hollowed-out area. And the second hollowed-out area is located on one side of the first hollowed-out area, communicated with the first hollowed-out area and protruded relative to the first hollowed-out area. The silicon optical chip is located in the hollowed-out area, the edge of the silicon optical chip is provided with a fifth bonding pad, an included angle area defined by two edges adjacent to the second hollowed-out area is located in the second hollowed-out area, and the two edges adjacent to the second hollowed-out area comprise the edge where the fifth bonding pad is located. A preset gap is formed between the edge of the fifth bonding pad and the edge of the circuit board where the first bonding pad is located, and the fifth bonding pad is in routing connection with the first bonding pad. The second hollowed-out area protrudes relative to the first hollowed-out area, the area defined by