Intelligent card
The utility model relates to an intelligent card, belongs to the technical field of intelligent card packaging, and solves the problems that the conventional intelligent card based on thermoplastic plastics is easy to wear, age, yellow, deform, bend, layer and the like. The intelligent card comprise...
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| creator | LIU QING WANG HAIQUAN XIONG HUA DU ZHUO QI JUN SUN CHUNGUI |
| description | The utility model relates to an intelligent card, belongs to the technical field of intelligent card packaging, and solves the problems that the conventional intelligent card based on thermoplastic plastics is easy to wear, age, yellow, deform, bend, layer and the like. The intelligent card comprises an intelligent card carrier, a first substrate and a chip, etching a circuit on the first substrate and welding a chip, wherein the circuit is electrically connected with the chip; the intelligent card carrier is provided with an avoiding groove, and the chip is accommodated in the avoiding groove. The first substrate is a glass fiber board, and the intelligent card carrier and the first substrate are attached at high temperature and high pressure through a thermocuring adhesive/film. According to the intelligent card, the substrate made of the glass fiber material is selected, and the circuit is etched on the substrate, so that the stability of the etched circuit and the combinability between the etched circuit |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217506567UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217506567UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217506567UU3</originalsourceid><addsrcrecordid>eNrjZBDwzCtJzcnJTE_NK1FITixK4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RobmpgZmpmbmoaHGRCkCAO1GIBI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Intelligent card</title><source>esp@cenet</source><creator>LIU QING ; WANG HAIQUAN ; XIONG HUA ; DU ZHUO ; QI JUN ; SUN CHUNGUI</creator><creatorcontrib>LIU QING ; WANG HAIQUAN ; XIONG HUA ; DU ZHUO ; QI JUN ; SUN CHUNGUI</creatorcontrib><description>The utility model relates to an intelligent card, belongs to the technical field of intelligent card packaging, and solves the problems that the conventional intelligent card based on thermoplastic plastics is easy to wear, age, yellow, deform, bend, layer and the like. The intelligent card comprises an intelligent card carrier, a first substrate and a chip, etching a circuit on the first substrate and welding a chip, wherein the circuit is electrically connected with the chip; the intelligent card carrier is provided with an avoiding groove, and the chip is accommodated in the avoiding groove. The first substrate is a glass fiber board, and the intelligent card carrier and the first substrate are attached at high temperature and high pressure through a thermocuring adhesive/film. According to the intelligent card, the substrate made of the glass fiber material is selected, and the circuit is etched on the substrate, so that the stability of the etched circuit and the combinability between the etched circuit</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220927&DB=EPODOC&CC=CN&NR=217506567U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220927&DB=EPODOC&CC=CN&NR=217506567U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU QING</creatorcontrib><creatorcontrib>WANG HAIQUAN</creatorcontrib><creatorcontrib>XIONG HUA</creatorcontrib><creatorcontrib>DU ZHUO</creatorcontrib><creatorcontrib>QI JUN</creatorcontrib><creatorcontrib>SUN CHUNGUI</creatorcontrib><title>Intelligent card</title><description>The utility model relates to an intelligent card, belongs to the technical field of intelligent card packaging, and solves the problems that the conventional intelligent card based on thermoplastic plastics is easy to wear, age, yellow, deform, bend, layer and the like. The intelligent card comprises an intelligent card carrier, a first substrate and a chip, etching a circuit on the first substrate and welding a chip, wherein the circuit is electrically connected with the chip; the intelligent card carrier is provided with an avoiding groove, and the chip is accommodated in the avoiding groove. The first substrate is a glass fiber board, and the intelligent card carrier and the first substrate are attached at high temperature and high pressure through a thermocuring adhesive/film. According to the intelligent card, the substrate made of the glass fiber material is selected, and the circuit is etched on the substrate, so that the stability of the etched circuit and the combinability between the etched circuit</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDwzCtJzcnJTE_NK1FITixK4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RobmpgZmpmbmoaHGRCkCAO1GIBI</recordid><startdate>20220927</startdate><enddate>20220927</enddate><creator>LIU QING</creator><creator>WANG HAIQUAN</creator><creator>XIONG HUA</creator><creator>DU ZHUO</creator><creator>QI JUN</creator><creator>SUN CHUNGUI</creator><scope>EVB</scope></search><sort><creationdate>20220927</creationdate><title>Intelligent card</title><author>LIU QING ; WANG HAIQUAN ; XIONG HUA ; DU ZHUO ; QI JUN ; SUN CHUNGUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217506567UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU QING</creatorcontrib><creatorcontrib>WANG HAIQUAN</creatorcontrib><creatorcontrib>XIONG HUA</creatorcontrib><creatorcontrib>DU ZHUO</creatorcontrib><creatorcontrib>QI JUN</creatorcontrib><creatorcontrib>SUN CHUNGUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU QING</au><au>WANG HAIQUAN</au><au>XIONG HUA</au><au>DU ZHUO</au><au>QI JUN</au><au>SUN CHUNGUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Intelligent card</title><date>2022-09-27</date><risdate>2022</risdate><abstract>The utility model relates to an intelligent card, belongs to the technical field of intelligent card packaging, and solves the problems that the conventional intelligent card based on thermoplastic plastics is easy to wear, age, yellow, deform, bend, layer and the like. The intelligent card comprises an intelligent card carrier, a first substrate and a chip, etching a circuit on the first substrate and welding a chip, wherein the circuit is electrically connected with the chip; the intelligent card carrier is provided with an avoiding groove, and the chip is accommodated in the avoiding groove. The first substrate is a glass fiber board, and the intelligent card carrier and the first substrate are attached at high temperature and high pressure through a thermocuring adhesive/film. According to the intelligent card, the substrate made of the glass fiber material is selected, and the circuit is etched on the substrate, so that the stability of the etched circuit and the combinability between the etched circuit</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN217506567UU |
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| subjects | CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS TRANSPORTING |
| title | Intelligent card |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T03%3A27%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU%20QING&rft.date=2022-09-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN217506567UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |