Hinge type epitaxial wafer packaging box
The utility model discloses a hinge type epitaxial wafer packaging box, which comprises a bottom box, a top box, a top box and a bottom box, the plurality of middle partition boxes are stacked on the bottom box layer by layer, each middle partition box comprises a middle partition disc, a second epi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a hinge type epitaxial wafer packaging box, which comprises a bottom box, a top box, a top box and a bottom box, the plurality of middle partition boxes are stacked on the bottom box layer by layer, each middle partition box comprises a middle partition disc, a second epitaxial wafer groove and a first outer edge groove are formed in the two faces of each middle partition disc respectively, and each first outer edge groove can be buckled with the second epitaxial wafer groove or the first epitaxial wafer groove of the corresponding middle partition box in the next layer; the first epitaxial wafer groove and the second epitaxial wafer groove are both used for placing epitaxial wafers; the top cover is provided with a second outer edge groove, and the second outer edge groove can be buckled with the second epitaxial wafer groove of the middle partition box arranged on the top layer; wherein one side of the bottom box, one side of the middle partition box and one side of the top cover |
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