Cover plate assembly of electronic equipment and electronic equipment
The utility model discloses a cover plate assembly of an electronic device and the electronic device, the cover plate assembly of the electronic device comprises a panel, the panel is a transparent panel, the panel is provided with a front side and a back side, the back side is internally provided w...
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creator | QIAO YONGLONG |
description | The utility model discloses a cover plate assembly of an electronic device and the electronic device, the cover plate assembly of the electronic device comprises a panel, the panel is a transparent panel, the panel is provided with a front side and a back side, the back side is internally provided with a recessed groove, and the groove forms a logo; the front surface paint layer is arranged on the front surface; the reverse side film is arranged on the reverse side; and the reverse side paint layer is arranged on the reverse side film. The reverse surface film and the reverse surface paint layer are arranged on the reverse surface of the panel, so that the metal texture and the stereoscopic impression of the logo can be improved, edges and corners of the logo are more obvious, the overall effect of the cover plate assembly can be improved, the front surface paint layer is arranged on the front surface of the panel, and the overall structure of the cover plate assembly can be protected by the front surface pai |
format | Patent |
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The reverse surface film and the reverse surface paint layer are arranged on the reverse surface of the panel, so that the metal texture and the stereoscopic impression of the logo can be improved, edges and corners of the logo are more obvious, the overall effect of the cover plate assembly can be improved, the front surface paint layer is arranged on the front surface of the panel, and the overall structure of the cover plate assembly can be protected by the front surface pai</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220920&DB=EPODOC&CC=CN&NR=217470508U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220920&DB=EPODOC&CC=CN&NR=217470508U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIAO YONGLONG</creatorcontrib><title>Cover plate assembly of electronic equipment and electronic equipment</title><description>The utility model discloses a cover plate assembly of an electronic device and the electronic device, the cover plate assembly of the electronic device comprises a panel, the panel is a transparent panel, the panel is provided with a front side and a back side, the back side is internally provided with a recessed groove, and the groove forms a logo; the front surface paint layer is arranged on the front surface; the reverse side film is arranged on the reverse side; and the reverse side paint layer is arranged on the reverse side film. The reverse surface film and the reverse surface paint layer are arranged on the reverse surface of the panel, so that the metal texture and the stereoscopic impression of the logo can be improved, edges and corners of the logo are more obvious, the overall effect of the cover plate assembly can be improved, the front surface paint layer is arranged on the front surface of the panel, and the overall structure of the cover plate assembly can be protected by the front surface pai</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1zi9LLVIoyEksSVVILC5OzU3KqVTIT1NIzUlNLinKz8tMVkgtLM0syE3NK1FIzEvBKsHDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-Kd_YwMzU3MDUwNLEJDjYlSBACPtzSB</recordid><startdate>20220920</startdate><enddate>20220920</enddate><creator>QIAO YONGLONG</creator><scope>EVB</scope></search><sort><creationdate>20220920</creationdate><title>Cover plate assembly of electronic equipment and electronic equipment</title><author>QIAO YONGLONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217470508UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>QIAO YONGLONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QIAO YONGLONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cover plate assembly of electronic equipment and electronic equipment</title><date>2022-09-20</date><risdate>2022</risdate><abstract>The utility model discloses a cover plate assembly of an electronic device and the electronic device, the cover plate assembly of the electronic device comprises a panel, the panel is a transparent panel, the panel is provided with a front side and a back side, the back side is internally provided with a recessed groove, and the groove forms a logo; the front surface paint layer is arranged on the front surface; the reverse side film is arranged on the reverse side; and the reverse side paint layer is arranged on the reverse side film. The reverse surface film and the reverse surface paint layer are arranged on the reverse surface of the panel, so that the metal texture and the stereoscopic impression of the logo can be improved, edges and corners of the logo are more obvious, the overall effect of the cover plate assembly can be improved, the front surface paint layer is arranged on the front surface of the panel, and the overall structure of the cover plate assembly can be protected by the front surface pai</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_CN217470508UU |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Cover plate assembly of electronic equipment and electronic equipment |
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