Chassis heat dissipation structure for drawer seat
The utility model relates to an underframe heat dissipation structure for a drawer seat, which comprises an underframe, a cavity A, a cavity B and a cavity C are arranged in the underframe, a first interlayer and a second interlayer are arranged in the middle of the cavity B, the cavity B above the...
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| creator | SHI ZHENGDONG SU XIANJIE HONG LEI |
| description | The utility model relates to an underframe heat dissipation structure for a drawer seat, which comprises an underframe, a cavity A, a cavity B and a cavity C are arranged in the underframe, a first interlayer and a second interlayer are arranged in the middle of the cavity B, the cavity B above the first interlayer is used as an upper cavity B, a rod cavity is formed between the first interlayer and the second interlayer, and the cavity B below the second interlayer is used as a lower cavity B; a plurality of first heat dissipation holes are formed in the first interlayer, each first heat dissipation hole vertically communicates with the B upper cavity and the rod cavity, a plurality of second heat dissipation holes are formed in the second interlayer, and each second heat dissipation hole vertically communicates with the B lower cavity and the rod cavity; the ejector rod is movably arranged in the rod cavity, and a plurality of third heat dissipation holes are formed in the ejector rod; and the B upper cavit |
| format | Patent |
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a plurality of first heat dissipation holes are formed in the first interlayer, each first heat dissipation hole vertically communicates with the B upper cavity and the rod cavity, a plurality of second heat dissipation holes are formed in the second interlayer, and each second heat dissipation hole vertically communicates with the B lower cavity and the rod cavity; the ejector rod is movably arranged in the rod cavity, and a plurality of third heat dissipation holes are formed in the ejector rod; and the B upper cavit</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220909&DB=EPODOC&CC=CN&NR=217406927U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220909&DB=EPODOC&CC=CN&NR=217406927U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHI ZHENGDONG</creatorcontrib><creatorcontrib>SU XIANJIE</creatorcontrib><creatorcontrib>HONG LEI</creatorcontrib><title>Chassis heat dissipation structure for drawer seat</title><description>The utility model relates to an underframe heat dissipation structure for a drawer seat, which comprises an underframe, a cavity A, a cavity B and a cavity C are arranged in the underframe, a first interlayer and a second interlayer are arranged in the middle of the cavity B, the cavity B above the first interlayer is used as an upper cavity B, a rod cavity is formed between the first interlayer and the second interlayer, and the cavity B below the second interlayer is used as a lower cavity B; a plurality of first heat dissipation holes are formed in the first interlayer, each first heat dissipation hole vertically communicates with the B upper cavity and the rod cavity, a plurality of second heat dissipation holes are formed in the second interlayer, and each second heat dissipation hole vertically communicates with the B lower cavity and the rod cavity; the ejector rod is movably arranged in the rod cavity, and a plurality of third heat dissipation holes are formed in the ejector rod; and the B upper cavit</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDByzkgsLs4sVshITSxRSMkEsgsSSzLz8xSKS4pKk0tKi1IV0vKLFFKKEstTixSKgap4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RobmJgZmlkXloqDFRigBM6y06</recordid><startdate>20220909</startdate><enddate>20220909</enddate><creator>SHI ZHENGDONG</creator><creator>SU XIANJIE</creator><creator>HONG LEI</creator><scope>EVB</scope></search><sort><creationdate>20220909</creationdate><title>Chassis heat dissipation structure for drawer seat</title><author>SHI ZHENGDONG ; 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a plurality of first heat dissipation holes are formed in the first interlayer, each first heat dissipation hole vertically communicates with the B upper cavity and the rod cavity, a plurality of second heat dissipation holes are formed in the second interlayer, and each second heat dissipation hole vertically communicates with the B lower cavity and the rod cavity; the ejector rod is movably arranged in the rod cavity, and a plurality of third heat dissipation holes are formed in the ejector rod; and the B upper cavit</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Chassis heat dissipation structure for drawer seat |
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