Chip packaging structure

The utility model provides a chip packaging structure. The structure comprises a chip substrate, a first metal layer, an insulating layer and a second metal layer. The chip base body comprises a base material with a first surface and a second surface which are oppositely arranged, and the first surf...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HONG FANGYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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