Heat dissipation module

A heat dissipation module comprises a uniform temperature plate, a first fin group and a heat pipe group. The vapor chamber is used for making thermal contact with a heating source, the first fin set comprises a plurality of first fins which are sequentially arranged in parallel, the heat pipe set c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GAO SHIJIE, QIU BAIJUN, ZHANG ZHEJIA, HUANG JUNWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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