Optical module

The optical module provided by the utility model comprises a shell which forms a wrapping inner cavity, and the inner wall of the shell is provided with a first heat conduction boss; the circuit board is arranged in the wrapping inner cavity; the silicon optical chip is electrically connected with t...

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Hauptverfasser:	SUN XIANGXUN, ZHU HUA, HAN JIHONG, SHAO QIAN, YAO JIANWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
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creator	SUN XIANGXUN ZHU HUA HAN JIHONG SHAO QIAN YAO JIANWEI
description	The optical module provided by the utility model comprises a shell which forms a wrapping inner cavity, and the inner wall of the shell is provided with a first heat conduction boss; the circuit board is arranged in the wrapping inner cavity; the silicon optical chip is electrically connected with the circuit board; the top of the silicon optical chip comprises a non-heat-dissipation area, a first heat dissipation area and a second heat dissipation area. The non-heat-dissipation area is located on the side, close to the end of the first heat dissipation area, of the second heat dissipation area. An isolation groove is formed in the end, not connected with the inner wall of the shell, of the first heat conduction boss and divides the end, away from the inner wall of the shell, of the first heat conduction boss into a first heat conduction area and a second heat conduction area, a chamfer is arranged at the position, close to the non-heat-dissipation area, of the second heat conduction area, and the chamfer is
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217332937UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217332937UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217332937UU3</originalsourceid><addsrcrecordid>eNrjZODzLyjJTE7MUcjNTynNSeVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaG5sbGRpbG5qGhxkQpAgCY5h9F</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Optical module</title><source>esp@cenet</source><creator>SUN XIANGXUN ; ZHU HUA ; HAN JIHONG ; SHAO QIAN ; YAO JIANWEI</creator><creatorcontrib>SUN XIANGXUN ; ZHU HUA ; HAN JIHONG ; SHAO QIAN ; YAO JIANWEI</creatorcontrib><description>The optical module provided by the utility model comprises a shell which forms a wrapping inner cavity, and the inner wall of the shell is provided with a first heat conduction boss; the circuit board is arranged in the wrapping inner cavity; the silicon optical chip is electrically connected with the circuit board; the top of the silicon optical chip comprises a non-heat-dissipation area, a first heat dissipation area and a second heat dissipation area. The non-heat-dissipation area is located on the side, close to the end of the first heat dissipation area, of the second heat dissipation area. An isolation groove is formed in the end, not connected with the inner wall of the shell, of the first heat conduction boss and divides the end, away from the inner wall of the shell, of the first heat conduction boss into a first heat conduction area and a second heat conduction area, a chamfer is arranged at the position, close to the non-heat-dissipation area, of the second heat conduction area, and the chamfer is</description><language>chi ; eng</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220830&DB=EPODOC&CC=CN&NR=217332937U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220830&DB=EPODOC&CC=CN&NR=217332937U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN XIANGXUN</creatorcontrib><creatorcontrib>ZHU HUA</creatorcontrib><creatorcontrib>HAN JIHONG</creatorcontrib><creatorcontrib>SHAO QIAN</creatorcontrib><creatorcontrib>YAO JIANWEI</creatorcontrib><title>Optical module</title><description>The optical module provided by the utility model comprises a shell which forms a wrapping inner cavity, and the inner wall of the shell is provided with a first heat conduction boss; the circuit board is arranged in the wrapping inner cavity; the silicon optical chip is electrically connected with the circuit board; the top of the silicon optical chip comprises a non-heat-dissipation area, a first heat dissipation area and a second heat dissipation area. The non-heat-dissipation area is located on the side, close to the end of the first heat dissipation area, of the second heat dissipation area. An isolation groove is formed in the end, not connected with the inner wall of the shell, of the first heat conduction boss and divides the end, away from the inner wall of the shell, of the first heat conduction boss into a first heat conduction area and a second heat conduction area, a chamfer is arranged at the position, close to the non-heat-dissipation area, of the second heat conduction area, and the chamfer is</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODzLyjJTE7MUcjNTynNSeVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaG5sbGRpbG5qGhxkQpAgCY5h9F</recordid><startdate>20220830</startdate><enddate>20220830</enddate><creator>SUN XIANGXUN</creator><creator>ZHU HUA</creator><creator>HAN JIHONG</creator><creator>SHAO QIAN</creator><creator>YAO JIANWEI</creator><scope>EVB</scope></search><sort><creationdate>20220830</creationdate><title>Optical module</title><author>SUN XIANGXUN ; ZHU HUA ; HAN JIHONG ; SHAO QIAN ; YAO JIANWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217332937UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>SUN XIANGXUN</creatorcontrib><creatorcontrib>ZHU HUA</creatorcontrib><creatorcontrib>HAN JIHONG</creatorcontrib><creatorcontrib>SHAO QIAN</creatorcontrib><creatorcontrib>YAO JIANWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUN XIANGXUN</au><au>ZHU HUA</au><au>HAN JIHONG</au><au>SHAO QIAN</au><au>YAO JIANWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optical module</title><date>2022-08-30</date><risdate>2022</risdate><abstract>The optical module provided by the utility model comprises a shell which forms a wrapping inner cavity, and the inner wall of the shell is provided with a first heat conduction boss; the circuit board is arranged in the wrapping inner cavity; the silicon optical chip is electrically connected with the circuit board; the top of the silicon optical chip comprises a non-heat-dissipation area, a first heat dissipation area and a second heat dissipation area. The non-heat-dissipation area is located on the side, close to the end of the first heat dissipation area, of the second heat dissipation area. An isolation groove is formed in the end, not connected with the inner wall of the shell, of the first heat conduction boss and divides the end, away from the inner wall of the shell, of the first heat conduction boss into a first heat conduction area and a second heat conduction area, a chamfer is arranged at the position, close to the non-heat-dissipation area, of the second heat conduction area, and the chamfer is</abstract><oa>free_for_read</oa></addata></record>
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subjects	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
title	Optical module
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