Smart phone with liquid heat dissipation mechanism convenient to install
The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopi...
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creator | YIN SHOUFU |
description | The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217283030UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217283030UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217283030UU3</originalsourceid><addsrcrecordid>eNqNyjEOwjAMAMAsDAj4g8VeqTQD7BWoEwt0rqzUKJYSJ9QGvs_CA5huubUbbhkXgxqLEHzYIiR-vniGSGgwsypXNC4CmUJEYc0QirxJmMTACrCoYUpbt3pgUtr93Lj95Xzvh4ZqmUgrBhKyqb92h2N38q1vx9H_lb5G_TWN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><source>esp@cenet</source><creator>YIN SHOUFU</creator><creatorcontrib>YIN SHOUFU</creatorcontrib><description>The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220823&DB=EPODOC&CC=CN&NR=217283030U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220823&DB=EPODOC&CC=CN&NR=217283030U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YIN SHOUFU</creatorcontrib><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><description>The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEOwjAMAMAsDAj4g8VeqTQD7BWoEwt0rqzUKJYSJ9QGvs_CA5huubUbbhkXgxqLEHzYIiR-vniGSGgwsypXNC4CmUJEYc0QirxJmMTACrCoYUpbt3pgUtr93Lj95Xzvh4ZqmUgrBhKyqb92h2N38q1vx9H_lb5G_TWN</recordid><startdate>20220823</startdate><enddate>20220823</enddate><creator>YIN SHOUFU</creator><scope>EVB</scope></search><sort><creationdate>20220823</creationdate><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><author>YIN SHOUFU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217283030UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>YIN SHOUFU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YIN SHOUFU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><date>2022-08-23</date><risdate>2022</risdate><abstract>The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
title | Smart phone with liquid heat dissipation mechanism convenient to install |
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