Smart phone with liquid heat dissipation mechanism convenient to install

The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YIN SHOUFU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YIN SHOUFU
description The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217283030UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217283030UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217283030UU3</originalsourceid><addsrcrecordid>eNqNyjEOwjAMAMAsDAj4g8VeqTQD7BWoEwt0rqzUKJYSJ9QGvs_CA5huubUbbhkXgxqLEHzYIiR-vniGSGgwsypXNC4CmUJEYc0QirxJmMTACrCoYUpbt3pgUtr93Lj95Xzvh4ZqmUgrBhKyqb92h2N38q1vx9H_lb5G_TWN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><source>esp@cenet</source><creator>YIN SHOUFU</creator><creatorcontrib>YIN SHOUFU</creatorcontrib><description>The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220823&amp;DB=EPODOC&amp;CC=CN&amp;NR=217283030U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220823&amp;DB=EPODOC&amp;CC=CN&amp;NR=217283030U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YIN SHOUFU</creatorcontrib><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><description>The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEOwjAMAMAsDAj4g8VeqTQD7BWoEwt0rqzUKJYSJ9QGvs_CA5huubUbbhkXgxqLEHzYIiR-vniGSGgwsypXNC4CmUJEYc0QirxJmMTACrCoYUpbt3pgUtr93Lj95Xzvh4ZqmUgrBhKyqb92h2N38q1vx9H_lb5G_TWN</recordid><startdate>20220823</startdate><enddate>20220823</enddate><creator>YIN SHOUFU</creator><scope>EVB</scope></search><sort><creationdate>20220823</creationdate><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><author>YIN SHOUFU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217283030UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>YIN SHOUFU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YIN SHOUFU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Smart phone with liquid heat dissipation mechanism convenient to install</title><date>2022-08-23</date><risdate>2022</risdate><abstract>The utility model discloses an intelligent mobile phone with a liquid heat dissipation mechanism convenient to install, which comprises the intelligent mobile phone, the bottom surface of the intelligent mobile phone is provided with a shell, the intelligent mobile phone is provided with a telescopic pipe outside the shell, the two sides of the telescopic pipe are provided with fixing plates, the opposite surfaces of the fixing plates are provided with a plurality of clamping grooves, and the clamping grooves are connected with the shell. A bottom plate is installed on the bottom face of the telescopic pipe, the two ends of the bottom plate are bent to form fixing parts, the outer side faces of the fixing parts protrude to form a plurality of clamping blocks, a plurality of cooling fins are installed in the shell, and an ultrasonic atomization piece is installed in the middle of the shell. The intelligent mobile phone cooling device is simple in structure and convenient to carry, water in the shell can be ato</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN217283030UU
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TELEPHONIC COMMUNICATION
title Smart phone with liquid heat dissipation mechanism convenient to install
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T09%3A04%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YIN%20SHOUFU&rft.date=2022-08-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN217283030UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true