Heat dissipation module and projection equipment
The utility model discloses a heat dissipation module and projection equipment. The heat dissipation module comprises a substrate, a plurality of heat sources, a plurality of heat dissipation fins and a fan. The heat sources are arranged on the surface of one side of the substrate at intervals, and...
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creator | JANG SANG-WOONG ZHANG XIANPENG LI YI |
description | The utility model discloses a heat dissipation module and projection equipment. The heat dissipation module comprises a substrate, a plurality of heat sources, a plurality of heat dissipation fins and a fan. The heat sources are arranged on the surface of one side of the substrate at intervals, and the partition grooves are located in interval areas of the heat sources. The multiple cooling fins are arranged on the surface of the side, away from the multiple heat sources, of the base plate at intervals, the multiple cooling fins are connected with the base plate and matched with the base plate to form a cooling air channel, and the fan is arranged at an air inlet or an air outlet of the cooling air channel. Therefore, the multiple heat sources of the heat dissipation module can share the substrate and the heat dissipation fins, heat dissipation is achieved through the fan, the multiple heat sources can share the heat dissipation air channel, the flow field resistance in the heat dissipation air channel can be |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217157067UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217157067UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217157067UU3</originalsourceid><addsrcrecordid>eNrjZDDwSE0sUUjJLC7OLEgsyczPU8jNTynNSVVIzEtRKCjKz0pNBoumFpZmFuSm5pXwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz8jQ3NDU3MDM_PQUGOiFAEA5Mssig</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat dissipation module and projection equipment</title><source>esp@cenet</source><creator>JANG SANG-WOONG ; ZHANG XIANPENG ; LI YI</creator><creatorcontrib>JANG SANG-WOONG ; ZHANG XIANPENG ; LI YI</creatorcontrib><description>The utility model discloses a heat dissipation module and projection equipment. The heat dissipation module comprises a substrate, a plurality of heat sources, a plurality of heat dissipation fins and a fan. The heat sources are arranged on the surface of one side of the substrate at intervals, and the partition grooves are located in interval areas of the heat sources. The multiple cooling fins are arranged on the surface of the side, away from the multiple heat sources, of the base plate at intervals, the multiple cooling fins are connected with the base plate and matched with the base plate to form a cooling air channel, and the fan is arranged at an air inlet or an air outlet of the cooling air channel. Therefore, the multiple heat sources of the heat dissipation module can share the substrate and the heat dissipation fins, heat dissipation is achieved through the fan, the multiple heat sources can share the heat dissipation air channel, the flow field resistance in the heat dissipation air channel can be</description><language>chi ; eng</language><subject>ACCESSORIES THEREFOR ; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES ; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; PHOTOGRAPHY ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220809&DB=EPODOC&CC=CN&NR=217157067U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220809&DB=EPODOC&CC=CN&NR=217157067U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANG SANG-WOONG</creatorcontrib><creatorcontrib>ZHANG XIANPENG</creatorcontrib><creatorcontrib>LI YI</creatorcontrib><title>Heat dissipation module and projection equipment</title><description>The utility model discloses a heat dissipation module and projection equipment. The heat dissipation module comprises a substrate, a plurality of heat sources, a plurality of heat dissipation fins and a fan. The heat sources are arranged on the surface of one side of the substrate at intervals, and the partition grooves are located in interval areas of the heat sources. The multiple cooling fins are arranged on the surface of the side, away from the multiple heat sources, of the base plate at intervals, the multiple cooling fins are connected with the base plate and matched with the base plate to form a cooling air channel, and the fan is arranged at an air inlet or an air outlet of the cooling air channel. Therefore, the multiple heat sources of the heat dissipation module can share the substrate and the heat dissipation fins, heat dissipation is achieved through the fan, the multiple heat sources can share the heat dissipation air channel, the flow field resistance in the heat dissipation air channel can be</description><subject>ACCESSORIES THEREFOR</subject><subject>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</subject><subject>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>PHOTOGRAPHY</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwSE0sUUjJLC7OLEgsyczPU8jNTynNSVVIzEtRKCjKz0pNBoumFpZmFuSm5pXwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz8jQ3NDU3MDM_PQUGOiFAEA5Mssig</recordid><startdate>20220809</startdate><enddate>20220809</enddate><creator>JANG SANG-WOONG</creator><creator>ZHANG XIANPENG</creator><creator>LI YI</creator><scope>EVB</scope></search><sort><creationdate>20220809</creationdate><title>Heat dissipation module and projection equipment</title><author>JANG SANG-WOONG ; ZHANG XIANPENG ; LI YI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217157067UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ACCESSORIES THEREFOR</topic><topic>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</topic><topic>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>PHOTOGRAPHY</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>JANG SANG-WOONG</creatorcontrib><creatorcontrib>ZHANG XIANPENG</creatorcontrib><creatorcontrib>LI YI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JANG SANG-WOONG</au><au>ZHANG XIANPENG</au><au>LI YI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat dissipation module and projection equipment</title><date>2022-08-09</date><risdate>2022</risdate><abstract>The utility model discloses a heat dissipation module and projection equipment. The heat dissipation module comprises a substrate, a plurality of heat sources, a plurality of heat dissipation fins and a fan. The heat sources are arranged on the surface of one side of the substrate at intervals, and the partition grooves are located in interval areas of the heat sources. The multiple cooling fins are arranged on the surface of the side, away from the multiple heat sources, of the base plate at intervals, the multiple cooling fins are connected with the base plate and matched with the base plate to form a cooling air channel, and the fan is arranged at an air inlet or an air outlet of the cooling air channel. Therefore, the multiple heat sources of the heat dissipation module can share the substrate and the heat dissipation fins, heat dissipation is achieved through the fan, the multiple heat sources can share the heat dissipation air channel, the flow field resistance in the heat dissipation air channel can be</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY PHOTOGRAPHY PHYSICS |
title | Heat dissipation module and projection equipment |
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